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JPS555917A - Polyamide composition - Google Patents

Polyamide composition

Info

Publication number
JPS555917A
JPS555917A JP7736278A JP7736278A JPS555917A JP S555917 A JPS555917 A JP S555917A JP 7736278 A JP7736278 A JP 7736278A JP 7736278 A JP7736278 A JP 7736278A JP S555917 A JPS555917 A JP S555917A
Authority
JP
Japan
Prior art keywords
copper
polyamide
alkyl
imidazole compound
tetrahydrobenzimidazole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7736278A
Other languages
Japanese (ja)
Other versions
JPS6145662B2 (en
Inventor
Yasuo Komatsu
Yasuo Takagi
Isao Yoshida
Kunihiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP7736278A priority Critical patent/JPS555917A/en
Publication of JPS555917A publication Critical patent/JPS555917A/en
Publication of JPS6145662B2 publication Critical patent/JPS6145662B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A polyamide composition that is prepared by adding an imidazole compound and copper to polyamide as nylon 6, thus being used for industrial material as tire or belt reinforcing because of its high heat stability.
CONSTITUTION: To polyamide as nylon 6 are added 0.01W1wt% of an imidazole compound of the fomula (R is H, alkyl of 4 or less carbon atoms) as 2-mercapto- 4,5,6,7-tetrahydrobenzimidazole or 1-alkyl-2-mercapto-4,5,6,7-tetrahydrobenzimidazole wherein the alkyl is methyl to butyl and 0.001W0.1wt%, preferably 0.003W 0.03wt%, based on copper element, of a copper compond as the halide, preferably iodide. In this case, preferably the copper compound is previously made to reacted with the imidazole compound and added to the polyamide in the form of halide copper complex.
COPYRIGHT: (C)1980,JPO&Japio
JP7736278A 1978-06-28 1978-06-28 Polyamide composition Granted JPS555917A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7736278A JPS555917A (en) 1978-06-28 1978-06-28 Polyamide composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7736278A JPS555917A (en) 1978-06-28 1978-06-28 Polyamide composition

Publications (2)

Publication Number Publication Date
JPS555917A true JPS555917A (en) 1980-01-17
JPS6145662B2 JPS6145662B2 (en) 1986-10-09

Family

ID=13631787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7736278A Granted JPS555917A (en) 1978-06-28 1978-06-28 Polyamide composition

Country Status (1)

Country Link
JP (1) JPS555917A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111892749A (en) * 2020-07-03 2020-11-06 浙江荣泰科技企业有限公司 Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111892749A (en) * 2020-07-03 2020-11-06 浙江荣泰科技企业有限公司 Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof
CN111892749B (en) * 2020-07-03 2022-03-22 浙江荣泰科技企业有限公司 Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof

Also Published As

Publication number Publication date
JPS6145662B2 (en) 1986-10-09

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