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JPS5541740A - Airtight seal device - Google Patents

Airtight seal device

Info

Publication number
JPS5541740A
JPS5541740A JP11466778A JP11466778A JPS5541740A JP S5541740 A JPS5541740 A JP S5541740A JP 11466778 A JP11466778 A JP 11466778A JP 11466778 A JP11466778 A JP 11466778A JP S5541740 A JPS5541740 A JP S5541740A
Authority
JP
Japan
Prior art keywords
burned
film
ring
cap
jointing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11466778A
Other languages
Japanese (ja)
Other versions
JPS6040703B2 (en
Inventor
Ryoji Iwamura
Mitsunari Kamata
Michiharu Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11466778A priority Critical patent/JPS6040703B2/en
Publication of JPS5541740A publication Critical patent/JPS5541740A/en
Publication of JPS6040703B2 publication Critical patent/JPS6040703B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE: To improve reliable airtightness in a semiconductor sealing device by providing a ring-like inserting member made of a readily diffusible metal between a jointing thick burned film and an overlying cap member.
CONSTITUTION: On a round Al2O3 base 1 are provided by print-burning a pair of conducting Ag/Pd layers 2, each having an opening in the middle. Between the paired layers 2, or in the middle of the base 1 is fixed a semiconductor element 8 which is connected to each layer 2 by a lead wire 11. A jointing, thick, burned Ag/Pd film 4 is formed on the outside end of each conducting layer 2, with a ring- like burned glass insulator 3 placed inbetween, and overlaid by a kover cap 6 having a gold-plating layer, essentially with a ring-like inserting member 5 of a readily diffusible metal, such as tin, gold, silver or palladium, placed inbetween. This arrangement serves to make the surface of the burned film 4 closely contact with the circumferential surface of the cap 6, even in the presence of any areas raised above or depressed below the surface of the film 4, and consequently improve airtightness.
COPYRIGHT: (C)1980,JPO&Japio
JP11466778A 1978-09-20 1978-09-20 Hermetic sealing method Expired JPS6040703B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11466778A JPS6040703B2 (en) 1978-09-20 1978-09-20 Hermetic sealing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11466778A JPS6040703B2 (en) 1978-09-20 1978-09-20 Hermetic sealing method

Publications (2)

Publication Number Publication Date
JPS5541740A true JPS5541740A (en) 1980-03-24
JPS6040703B2 JPS6040703B2 (en) 1985-09-12

Family

ID=14643567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11466778A Expired JPS6040703B2 (en) 1978-09-20 1978-09-20 Hermetic sealing method

Country Status (1)

Country Link
JP (1) JPS6040703B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998041354A1 (en) * 1997-03-17 1998-09-24 Hitachi, Ltd. Method of solid-phase welding members
CN109277686A (en) * 2018-11-07 2019-01-29 杨新容 A kind of lithium battery production nut cap press welding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998041354A1 (en) * 1997-03-17 1998-09-24 Hitachi, Ltd. Method of solid-phase welding members
CN109277686A (en) * 2018-11-07 2019-01-29 杨新容 A kind of lithium battery production nut cap press welding device
CN109277686B (en) * 2018-11-07 2021-01-15 杨新容 Nut cap pressure welding device for lithium battery production

Also Published As

Publication number Publication date
JPS6040703B2 (en) 1985-09-12

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