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JPS5535222A - Pressure transducer - Google Patents

Pressure transducer

Info

Publication number
JPS5535222A
JPS5535222A JP10764278A JP10764278A JPS5535222A JP S5535222 A JPS5535222 A JP S5535222A JP 10764278 A JP10764278 A JP 10764278A JP 10764278 A JP10764278 A JP 10764278A JP S5535222 A JPS5535222 A JP S5535222A
Authority
JP
Japan
Prior art keywords
cover
clicks
pressure
semiconductor diaphragm
arms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10764278A
Other languages
Japanese (ja)
Other versions
JPS6136164B2 (en
Inventor
Kaoru Uchiyama
Hitoshi Minorikawa
Minoru Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10764278A priority Critical patent/JPS5535222A/en
Publication of JPS5535222A publication Critical patent/JPS5535222A/en
Publication of JPS6136164B2 publication Critical patent/JPS6136164B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

PURPOSE:To make it possible to meniaturize a unit and also to maintain its airtightness definitely by providing clicks to both the sides of the arm of a cover with a pressure lead-in hole and the arm extending to the right and left, and by setting this cover to a circuit substrate via those clicks. CONSTITUTION:As for a pressure transducer equipped with circuit substrate 8 with semiconductor diaphragm 14 with a formed piezo-resistor and cover C covering semiconductor diaphragm 14, cover C has arms 2 and 3 extending symmetrically to the right and left on cylinder part 1. To fit cover C to circuit substrate 8, clicks 4 of arms 2 and 3 are set into notch parts 9 formed at the side edges of substrate 8, and arms are fixed to the reverse surface of substrate 8 by making use of elasticity of clicks 4; and semiconductor diaphragm 14 is completely covered with space part 6 and notch parts 7 are charged with adhesive 17 for airtight sealing. In this state, applying pressure from pressure lead-in hole 5 cause strain of semiconductor diaphragm 14 corresponding to the pressure.
JP10764278A 1978-09-04 1978-09-04 Pressure transducer Granted JPS5535222A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10764278A JPS5535222A (en) 1978-09-04 1978-09-04 Pressure transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10764278A JPS5535222A (en) 1978-09-04 1978-09-04 Pressure transducer

Publications (2)

Publication Number Publication Date
JPS5535222A true JPS5535222A (en) 1980-03-12
JPS6136164B2 JPS6136164B2 (en) 1986-08-16

Family

ID=14464360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10764278A Granted JPS5535222A (en) 1978-09-04 1978-09-04 Pressure transducer

Country Status (1)

Country Link
JP (1) JPS5535222A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7553071B2 (en) 2003-05-16 2009-06-30 Sitronic Gesellschaft für Elektrotechnische Ausrüstung mbH & Co. KG Sensor unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7553071B2 (en) 2003-05-16 2009-06-30 Sitronic Gesellschaft für Elektrotechnische Ausrüstung mbH & Co. KG Sensor unit

Also Published As

Publication number Publication date
JPS6136164B2 (en) 1986-08-16

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