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JPS5531810A - Solventless epoxy resin composition - Google Patents

Solventless epoxy resin composition

Info

Publication number
JPS5531810A
JPS5531810A JP10322878A JP10322878A JPS5531810A JP S5531810 A JPS5531810 A JP S5531810A JP 10322878 A JP10322878 A JP 10322878A JP 10322878 A JP10322878 A JP 10322878A JP S5531810 A JPS5531810 A JP S5531810A
Authority
JP
Japan
Prior art keywords
epoxy resin
composition
weight
parts
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10322878A
Other languages
Japanese (ja)
Other versions
JPS6160848B2 (en
Inventor
Hisataka Komai
Ryuji Kita
Hitoshi Takahata
Riso Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Nippon Zeon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Zeon Co Ltd filed Critical Nippon Zeon Co Ltd
Priority to JP10322878A priority Critical patent/JPS5531810A/en
Publication of JPS5531810A publication Critical patent/JPS5531810A/en
Publication of JPS6160848B2 publication Critical patent/JPS6160848B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare a solventless epoxy resin composition giving improved flexibility and adhesive properties without lowering processability and moldability, by compounding a composition comprising a liquid epoxy resin and a liquid acid anhydride curing agent with a specific resinous diluent.
CONSTITUTION: (A) 100 parts by weight of a liquid epoxy resin preferably having a viscosity of ≤100,000cp is mixed with (B) 20W200, preferably 30W160 parts by weight of a liquid acid anhydride curing agent preferably having a freezing point of ≤0°C (e.g. hexahydrophthalic anhydride, etc.), and (C) 5W100 parts by weight of a resinous diluent compatible with the epoxy resin and having a softening point of 60W130°C, preferably of 70W120°C (e.g. xylene resin, etc.). The composition has usually a viscosity of ≤100,000cp, preferably of ≤80,000cp at 25°C.
USE: Dipping, laminating, or molding composition, paint, sealant, etc. and particularly sealant, adhesive, etc. for mobile articles, e.g. automobiles, etc.
COPYRIGHT: (C)1980,JPO&Japio
JP10322878A 1978-08-24 1978-08-24 Solventless epoxy resin composition Granted JPS5531810A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10322878A JPS5531810A (en) 1978-08-24 1978-08-24 Solventless epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10322878A JPS5531810A (en) 1978-08-24 1978-08-24 Solventless epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS5531810A true JPS5531810A (en) 1980-03-06
JPS6160848B2 JPS6160848B2 (en) 1986-12-23

Family

ID=14348607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10322878A Granted JPS5531810A (en) 1978-08-24 1978-08-24 Solventless epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5531810A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55104426A (en) * 1979-01-30 1980-08-09 Nippon Kokan Kk <Nkk> Production for non-magnetic steel of low thermal expansion coefficient and high yield point
JPS58185722A (en) * 1982-04-21 1983-10-29 Nippon Steel Corp Manufacture of austenitic steel plate and band steel
JPS59109518A (en) * 1982-12-15 1984-06-25 Hitachi Chem Co Ltd Epoxy resin composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4861599A (en) * 1971-09-23 1973-08-29
JPS50134099A (en) * 1974-03-29 1975-10-23
JPS50139826A (en) * 1974-04-17 1975-11-08
JPS53125461A (en) * 1977-04-11 1978-11-01 Nippon Oil Co Ltd Epoxy resin composition
JPS5499166A (en) * 1978-01-20 1979-08-04 Japan Styrene Paper Corp Production of polyolefinic foamed resin

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4861599A (en) * 1971-09-23 1973-08-29
JPS50134099A (en) * 1974-03-29 1975-10-23
JPS50139826A (en) * 1974-04-17 1975-11-08
JPS53125461A (en) * 1977-04-11 1978-11-01 Nippon Oil Co Ltd Epoxy resin composition
JPS5499166A (en) * 1978-01-20 1979-08-04 Japan Styrene Paper Corp Production of polyolefinic foamed resin

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55104426A (en) * 1979-01-30 1980-08-09 Nippon Kokan Kk <Nkk> Production for non-magnetic steel of low thermal expansion coefficient and high yield point
JPS5931569B2 (en) * 1979-01-30 1984-08-02 日本鋼管株式会社 Manufacturing method of low thermal expansion coefficient high descending point non-magnetic steel
JPS58185722A (en) * 1982-04-21 1983-10-29 Nippon Steel Corp Manufacture of austenitic steel plate and band steel
JPS6054374B2 (en) * 1982-04-21 1985-11-29 新日本製鐵株式会社 Method for manufacturing austenitic steel plates and steel strips
JPS59109518A (en) * 1982-12-15 1984-06-25 Hitachi Chem Co Ltd Epoxy resin composition
JPS6257652B2 (en) * 1982-12-15 1987-12-02 Hitachi Chemical Co Ltd

Also Published As

Publication number Publication date
JPS6160848B2 (en) 1986-12-23

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