JPS5530818A - Method of surface treating printed circuit copper foil - Google Patents
Method of surface treating printed circuit copper foilInfo
- Publication number
- JPS5530818A JPS5530818A JP10291678A JP10291678A JPS5530818A JP S5530818 A JPS5530818 A JP S5530818A JP 10291678 A JP10291678 A JP 10291678A JP 10291678 A JP10291678 A JP 10291678A JP S5530818 A JPS5530818 A JP S5530818A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- copper foil
- surface treating
- circuit copper
- treating printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10291678A JPS5530818A (en) | 1978-08-25 | 1978-08-25 | Method of surface treating printed circuit copper foil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10291678A JPS5530818A (en) | 1978-08-25 | 1978-08-25 | Method of surface treating printed circuit copper foil |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5530818A true JPS5530818A (en) | 1980-03-04 |
JPS5641196B2 JPS5641196B2 (en) | 1981-09-26 |
Family
ID=14340172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10291678A Granted JPS5530818A (en) | 1978-08-25 | 1978-08-25 | Method of surface treating printed circuit copper foil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5530818A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981560A (en) * | 1988-03-25 | 1991-01-01 | Fukuda Metal Foil & Powder Industrial Co., Ltd. | Method of surface treatment of copper foil or a copper clad laminate for internal layer |
US7749610B2 (en) * | 2004-04-02 | 2010-07-06 | Mitsui Mining & Smelting Co., Ltd. | Copper foil and method of manufacturing the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS586045U (en) * | 1981-07-07 | 1983-01-14 | イ−グル工業株式会社 | floating ring |
JPS6041699U (en) * | 1983-08-31 | 1985-03-23 | 日研化工株式会社 | Gas cylinder moving part support device |
JPH08222857A (en) * | 1995-02-16 | 1996-08-30 | Mitsui Mining & Smelting Co Ltd | Copper foil and high-density multilayered printed circuit board using the foil for its internal-layer circuit |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5233074A (en) * | 1975-09-10 | 1977-03-12 | Nippon Mining Co | Surface treatment of printed circuit copper foil |
JPS5269125A (en) * | 1975-12-05 | 1977-06-08 | Borg Warner | Case for automatic transmission of fourrwheel driving system |
-
1978
- 1978-08-25 JP JP10291678A patent/JPS5530818A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5233074A (en) * | 1975-09-10 | 1977-03-12 | Nippon Mining Co | Surface treatment of printed circuit copper foil |
JPS5269125A (en) * | 1975-12-05 | 1977-06-08 | Borg Warner | Case for automatic transmission of fourrwheel driving system |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4981560A (en) * | 1988-03-25 | 1991-01-01 | Fukuda Metal Foil & Powder Industrial Co., Ltd. | Method of surface treatment of copper foil or a copper clad laminate for internal layer |
US7749610B2 (en) * | 2004-04-02 | 2010-07-06 | Mitsui Mining & Smelting Co., Ltd. | Copper foil and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS5641196B2 (en) | 1981-09-26 |
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