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JPS5526672A - Lead frame for semiconductor element - Google Patents

Lead frame for semiconductor element

Info

Publication number
JPS5526672A
JPS5526672A JP9970878A JP9970878A JPS5526672A JP S5526672 A JPS5526672 A JP S5526672A JP 9970878 A JP9970878 A JP 9970878A JP 9970878 A JP9970878 A JP 9970878A JP S5526672 A JPS5526672 A JP S5526672A
Authority
JP
Japan
Prior art keywords
lead frame
plate thickness
lead
metallic roller
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9970878A
Other languages
Japanese (ja)
Inventor
Seiji Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP9970878A priority Critical patent/JPS5526672A/en
Publication of JPS5526672A publication Critical patent/JPS5526672A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To permit a formation of a fine internal lead increasing the bending strength of an external lead, by making a plate thickness in a part of a lead frame thicker than the others, in a sheet of the lead frame for mounting a semiconductor element.
CONSTITUTION: In a sheet of lead frame, plate thickness in the vicinity of a semiconductor chip mounting portion of a single lead frame is made thicker than the other portions. In order to effect such a processing, the diameter of a metallic roller is set at two values, a pressing is pefformed by utilizing a metallic roller having a small diameter, and a central region for mounting a chip is pressed by using a metallic roller having a great diameter. According to such a process, the space of the internal lead can be narrow, because the plate thickness in the vicinity of the chip mounting portion is made small, therefore, a fine pattern formation can be established easily. Because the plate thickness is made thicker in the circumferential portions, a bending strength of the external lead can be increased. The molding should be provided from the thin region to the thick region in sealing it by using a mold.
COPYRIGHT: (C)1980,JPO&Japio
JP9970878A 1978-08-15 1978-08-15 Lead frame for semiconductor element Pending JPS5526672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9970878A JPS5526672A (en) 1978-08-15 1978-08-15 Lead frame for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9970878A JPS5526672A (en) 1978-08-15 1978-08-15 Lead frame for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5526672A true JPS5526672A (en) 1980-02-26

Family

ID=14254559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9970878A Pending JPS5526672A (en) 1978-08-15 1978-08-15 Lead frame for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5526672A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4482915A (en) * 1981-07-06 1984-11-13 Matsushita Electronics Corp. Lead frame for plastic encapsulated semiconductor device
JPS62122254A (en) * 1985-11-22 1987-06-03 Mitsubishi Electric Corp Frame for resin molded semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022876A (en) * 1973-06-29 1975-03-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022876A (en) * 1973-06-29 1975-03-11

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4482915A (en) * 1981-07-06 1984-11-13 Matsushita Electronics Corp. Lead frame for plastic encapsulated semiconductor device
JPS62122254A (en) * 1985-11-22 1987-06-03 Mitsubishi Electric Corp Frame for resin molded semiconductor device

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