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JPS5521118A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5521118A
JPS5521118A JP9359078A JP9359078A JPS5521118A JP S5521118 A JPS5521118 A JP S5521118A JP 9359078 A JP9359078 A JP 9359078A JP 9359078 A JP9359078 A JP 9359078A JP S5521118 A JPS5521118 A JP S5521118A
Authority
JP
Japan
Prior art keywords
lead
piece
frame
supported
dam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9359078A
Other languages
Japanese (ja)
Inventor
Takehisa Hamano
Tokio Iguchi
Masaru Tsunetomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP9359078A priority Critical patent/JPS5521118A/en
Publication of JPS5521118A publication Critical patent/JPS5521118A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To raise a work efficiency of a semiconductor manufacture by forming a dam portion with a resin. CONSTITUTION:A lead frame 2 having a strip configuration is made up of an outer frame 11 and 12 extending in a substantial parallel arrangement to a longitudinal direction a tab portion 14 supported by a joint piece 13 between the outer frames, a plurality of lead pieces 16 separated from the center of the tab portion 14 and supported by a joint piece 15 in the outer frane 15 provided in its circumference, and a dam portion 17 for interconnecting the lead pieces in the intermediate position between the inner lead portion 161 and outer lead portion 162 of the lead piece 16. The dam portion is made of the resin formed on the frame generally and is formed in a substantially equal thickness as the lead piece 16.
JP9359078A 1978-08-02 1978-08-02 Lead frame Pending JPS5521118A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9359078A JPS5521118A (en) 1978-08-02 1978-08-02 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9359078A JPS5521118A (en) 1978-08-02 1978-08-02 Lead frame

Publications (1)

Publication Number Publication Date
JPS5521118A true JPS5521118A (en) 1980-02-15

Family

ID=14086502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9359078A Pending JPS5521118A (en) 1978-08-02 1978-08-02 Lead frame

Country Status (1)

Country Link
JP (1) JPS5521118A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104687A (en) * 1980-12-23 1982-06-29 Nippon Light Metal Co Ltd Formation of opaque anodic oxide film of aluminum or its alloy
JPS63258051A (en) * 1987-04-15 1988-10-25 Fuji Plant Kogyo Kk Leadframe with pin holding structure and pin holding method of leadframe
JPS63283054A (en) * 1987-03-11 1988-11-18 Fuji Plant Kogyo Kk Lead frame with pin-holding structure and holding method for pin of lead frame
JPS6481260A (en) * 1987-09-22 1989-03-27 Fuji Plant Kogyo Kk Manufacture of lead frame having pin-retention structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104687A (en) * 1980-12-23 1982-06-29 Nippon Light Metal Co Ltd Formation of opaque anodic oxide film of aluminum or its alloy
JPS63283054A (en) * 1987-03-11 1988-11-18 Fuji Plant Kogyo Kk Lead frame with pin-holding structure and holding method for pin of lead frame
JPH0464468B2 (en) * 1987-03-11 1992-10-15 Fuji Plant Kogyo Kk
JPS63258051A (en) * 1987-04-15 1988-10-25 Fuji Plant Kogyo Kk Leadframe with pin holding structure and pin holding method of leadframe
JPS6481260A (en) * 1987-09-22 1989-03-27 Fuji Plant Kogyo Kk Manufacture of lead frame having pin-retention structure

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