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JPS55160439A - Device for fixing thin plate - Google Patents

Device for fixing thin plate

Info

Publication number
JPS55160439A
JPS55160439A JP6780479A JP6780479A JPS55160439A JP S55160439 A JPS55160439 A JP S55160439A JP 6780479 A JP6780479 A JP 6780479A JP 6780479 A JP6780479 A JP 6780479A JP S55160439 A JPS55160439 A JP S55160439A
Authority
JP
Japan
Prior art keywords
thin plate
circular
sections
partition chamber
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6780479A
Other languages
Japanese (ja)
Inventor
Shinichiro Takasu
Ichiro Mori
Koichiro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP6780479A priority Critical patent/JPS55160439A/en
Publication of JPS55160439A publication Critical patent/JPS55160439A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)

Abstract

PURPOSE:To flatly adsorb a thin plate without occurrence of a buckling by employing adsorbing means forming a thin plate fixing unit as a plurality of concentrically circular containers using present sections and sequentially attracting the thin plate sections and sequentially attracting the thin plate placed thereon from the central region to the peripheral region. CONSTITUTION:Circular sections 22a, 22b are concentrically disposed within the circular container 21, and a fixing plate 24 having a plurality of fine holes 23 at the opening end of the container 21 is engaged with the container 21 placed thereon. Then, vacuum pipes 28-30 are inserted into largely circular partition chamber 27 disposed outside a small circular partition chamber 26 surrounding the central circular columnar partition chamber 25 formed with the sections 22a, 22b and the partition chamber 25 while passing the bottoms of the containers 21 thereinto, and connected through solenoid control valves 32, 33 and an electromagnetic three-way valve 34 to an exhaust pump 35. Thereafter, the thin plate 37 such as silicon wafer of the like is placed on the plate 24, an opening and closing sequence controller 36 is operated to sequentially attract the thin plate 37 from the central region to the peripheral region.
JP6780479A 1979-05-31 1979-05-31 Device for fixing thin plate Pending JPS55160439A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6780479A JPS55160439A (en) 1979-05-31 1979-05-31 Device for fixing thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6780479A JPS55160439A (en) 1979-05-31 1979-05-31 Device for fixing thin plate

Publications (1)

Publication Number Publication Date
JPS55160439A true JPS55160439A (en) 1980-12-13

Family

ID=13355497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6780479A Pending JPS55160439A (en) 1979-05-31 1979-05-31 Device for fixing thin plate

Country Status (1)

Country Link
JP (1) JPS55160439A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5689744A (en) * 1979-12-24 1981-07-21 Fujitsu Ltd X-ray transfer device
JPS60127935A (en) * 1983-12-14 1985-07-08 Fujitsu Ltd wafer chuck
JPS60149755U (en) * 1984-03-13 1985-10-04 富士通株式会社 Parts fixing jig
US4721462A (en) * 1986-10-21 1988-01-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Active hold-down for heat treating
JPH01206644A (en) * 1988-02-13 1989-08-18 Shinkawa Ltd Substrate sucking structure
US5008702A (en) * 1988-09-07 1991-04-16 Hitachi, Ltd. Exposure method and apparatus
JPH0839376A (en) * 1994-07-29 1996-02-13 Ckd Corp Adsorbing plate of vacuum chuck and manufacture of vacuum chuck and adsorbing plate
US5724121A (en) * 1995-05-12 1998-03-03 Hughes Danbury Optical Systems, Inc. Mounting member method and apparatus with variable length supports
JP2010151993A (en) * 2008-12-24 2010-07-08 Casio Computer Co Ltd Display device
US8404496B2 (en) 1999-11-11 2013-03-26 Fujitsu Semiconductor Limited Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
CN111473039A (en) * 2020-03-04 2020-07-31 上海精测半导体技术有限公司 Flexible panel leveling apparatus and method
EP2748843B1 (en) * 2011-08-26 2023-01-04 SK Siltron Co., Ltd. Susceptor

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5689744A (en) * 1979-12-24 1981-07-21 Fujitsu Ltd X-ray transfer device
JPS60127935A (en) * 1983-12-14 1985-07-08 Fujitsu Ltd wafer chuck
JPS60149755U (en) * 1984-03-13 1985-10-04 富士通株式会社 Parts fixing jig
US4721462A (en) * 1986-10-21 1988-01-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Active hold-down for heat treating
JPH01206644A (en) * 1988-02-13 1989-08-18 Shinkawa Ltd Substrate sucking structure
US5008702A (en) * 1988-09-07 1991-04-16 Hitachi, Ltd. Exposure method and apparatus
JPH0839376A (en) * 1994-07-29 1996-02-13 Ckd Corp Adsorbing plate of vacuum chuck and manufacture of vacuum chuck and adsorbing plate
US5724121A (en) * 1995-05-12 1998-03-03 Hughes Danbury Optical Systems, Inc. Mounting member method and apparatus with variable length supports
US8404496B2 (en) 1999-11-11 2013-03-26 Fujitsu Semiconductor Limited Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
JP2010151993A (en) * 2008-12-24 2010-07-08 Casio Computer Co Ltd Display device
EP2748843B1 (en) * 2011-08-26 2023-01-04 SK Siltron Co., Ltd. Susceptor
CN111473039A (en) * 2020-03-04 2020-07-31 上海精测半导体技术有限公司 Flexible panel leveling apparatus and method

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