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JPS55148488A - Method of fabricating flexible printed circuit board - Google Patents

Method of fabricating flexible printed circuit board

Info

Publication number
JPS55148488A
JPS55148488A JP5722779A JP5722779A JPS55148488A JP S55148488 A JPS55148488 A JP S55148488A JP 5722779 A JP5722779 A JP 5722779A JP 5722779 A JP5722779 A JP 5722779A JP S55148488 A JPS55148488 A JP S55148488A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
flexible printed
fabricating flexible
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5722779A
Other languages
Japanese (ja)
Other versions
JPS6134376B2 (en
Inventor
Yasutoshi Satou
Keiji Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP5722779A priority Critical patent/JPS55148488A/en
Publication of JPS55148488A publication Critical patent/JPS55148488A/en
Publication of JPS6134376B2 publication Critical patent/JPS6134376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined

Landscapes

  • Laminated Bodies (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP5722779A 1979-05-09 1979-05-09 Method of fabricating flexible printed circuit board Granted JPS55148488A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5722779A JPS55148488A (en) 1979-05-09 1979-05-09 Method of fabricating flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5722779A JPS55148488A (en) 1979-05-09 1979-05-09 Method of fabricating flexible printed circuit board

Publications (2)

Publication Number Publication Date
JPS55148488A true JPS55148488A (en) 1980-11-19
JPS6134376B2 JPS6134376B2 (en) 1986-08-07

Family

ID=13049634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5722779A Granted JPS55148488A (en) 1979-05-09 1979-05-09 Method of fabricating flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPS55148488A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065598A (en) * 1983-09-20 1985-04-15 松下電器産業株式会社 Method of producing multilayer prined circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065598A (en) * 1983-09-20 1985-04-15 松下電器産業株式会社 Method of producing multilayer prined circuit board

Also Published As

Publication number Publication date
JPS6134376B2 (en) 1986-08-07

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