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JPS55145174A - Etching method of amorphous alloy material - Google Patents

Etching method of amorphous alloy material

Info

Publication number
JPS55145174A
JPS55145174A JP5183479A JP5183479A JPS55145174A JP S55145174 A JPS55145174 A JP S55145174A JP 5183479 A JP5183479 A JP 5183479A JP 5183479 A JP5183479 A JP 5183479A JP S55145174 A JPS55145174 A JP S55145174A
Authority
JP
Japan
Prior art keywords
alloy material
amorphous alloy
etching
etching method
pretreatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5183479A
Other languages
Japanese (ja)
Other versions
JPS6212308B2 (en
Inventor
Masaru Takayama
Masao Shigeta
Nobuo Yasui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP5183479A priority Critical patent/JPS55145174A/en
Publication of JPS55145174A publication Critical patent/JPS55145174A/en
Publication of JPS6212308B2 publication Critical patent/JPS6212308B2/ja
Granted legal-status Critical Current

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  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: To conduct etching efficiently without damaging physical properties of material, by, in etching of amorphous alloy material, forming a crystallization zone of a prescribed shape as a pretreatment.
CONSTITUTION: A crystallization zone of a prescribed shape is formed by means of a mask made of heat-insulating material or a masking shield on the surface of an amorphous alloy material composed of Fe, Co, Ni etc. and P, B, C, Si etc., and the alloy material is heated to a temp. not lower than the crystallization temp. by a suitable method. After completion of the pretreatment, a prescribed etching is performed. By this method, the amorphous alloy material is selectively etched quickly. This procedure is simpler than photoetching, and produces no working strain etc.
COPYRIGHT: (C)1980,JPO&Japio
JP5183479A 1979-04-26 1979-04-26 Etching method of amorphous alloy material Granted JPS55145174A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5183479A JPS55145174A (en) 1979-04-26 1979-04-26 Etching method of amorphous alloy material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5183479A JPS55145174A (en) 1979-04-26 1979-04-26 Etching method of amorphous alloy material

Publications (2)

Publication Number Publication Date
JPS55145174A true JPS55145174A (en) 1980-11-12
JPS6212308B2 JPS6212308B2 (en) 1987-03-18

Family

ID=12897884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5183479A Granted JPS55145174A (en) 1979-04-26 1979-04-26 Etching method of amorphous alloy material

Country Status (1)

Country Link
JP (1) JPS55145174A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61189930A (en) * 1985-02-19 1986-08-23 トッパン・ムーア株式会社 Laminated core material
JP2013118407A (en) * 2013-03-06 2013-06-13 Renesas Electronics Corp Method of manufacturing semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190944A (en) * 1975-02-07 1976-08-10 HISHOSHITSUKARUKOGENAIDOHAKUMAKUOMOCHIIRUFUOTOETSUCHINGUNOHOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5190944A (en) * 1975-02-07 1976-08-10 HISHOSHITSUKARUKOGENAIDOHAKUMAKUOMOCHIIRUFUOTOETSUCHINGUNOHOHO

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61189930A (en) * 1985-02-19 1986-08-23 トッパン・ムーア株式会社 Laminated core material
JP2013118407A (en) * 2013-03-06 2013-06-13 Renesas Electronics Corp Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS6212308B2 (en) 1987-03-18

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