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JPS55141721A - Sputtering apparatus for magnetic body - Google Patents

Sputtering apparatus for magnetic body

Info

Publication number
JPS55141721A
JPS55141721A JP4934079A JP4934079A JPS55141721A JP S55141721 A JPS55141721 A JP S55141721A JP 4934079 A JP4934079 A JP 4934079A JP 4934079 A JP4934079 A JP 4934079A JP S55141721 A JPS55141721 A JP S55141721A
Authority
JP
Japan
Prior art keywords
target
magnetic
generated
magnetic field
field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4934079A
Other languages
Japanese (ja)
Inventor
Tatsuo Asamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP4934079A priority Critical patent/JPS55141721A/en
Publication of JPS55141721A publication Critical patent/JPS55141721A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Thin Magnetic Films (AREA)

Abstract

PURPOSE:To decrease the strength of magnetic poles by utilizing a magnetic field, which lmits perpendicularly from the surface of a magnetic body, and an electric field which crosses the magnetic field at right angle. CONSTITUTION:A magnetic field 16 is provided at right angle with a magnetic- body target 11 by magnetic poles 12 and a yoke 13. When a specified potential is applied to the target 11, a grid-shaped anode 21, and the second target 31, a Penning discharge is generated, a negative space charge is generated within the grid- shaped anode 21, thereby an electric field 22 is generated. Plasma is generated by said electric field and magnetic field, ion currents enter into the target 11 or the second target 31, thereby the sputtering is performed. The sputtered target material attaches to the surface of a substrate 41, thereby a thin film is formed. Since the magnetic field which is in parallel with the surface of the magneic-body target is not formed, it is not required to form a powerful magneic field.
JP4934079A 1979-04-20 1979-04-20 Sputtering apparatus for magnetic body Pending JPS55141721A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4934079A JPS55141721A (en) 1979-04-20 1979-04-20 Sputtering apparatus for magnetic body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4934079A JPS55141721A (en) 1979-04-20 1979-04-20 Sputtering apparatus for magnetic body

Publications (1)

Publication Number Publication Date
JPS55141721A true JPS55141721A (en) 1980-11-05

Family

ID=12828261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4934079A Pending JPS55141721A (en) 1979-04-20 1979-04-20 Sputtering apparatus for magnetic body

Country Status (1)

Country Link
JP (1) JPS55141721A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109655A (en) * 1991-10-15 1993-04-30 Applied Materials Japan Kk CVD-sputter device
KR100751174B1 (en) 2005-07-13 2007-08-22 어플라이드 머티어리얼스, 인코포레이티드 Improved magnetron sputtering system for large-area substrates having removable anodes
JP2015501388A (en) * 2011-11-01 2015-01-15 ザ・ボーイング・カンパニーＴｈｅＢｏｅｉｎｇ Ｃｏｍｐａｎｙ Method and apparatus for deposition using atmospheric pressure plasma
WO2020165959A1 (en) * 2019-02-12 2020-08-20 齊藤　公章 Method for producing multi-metal fine particles and method for producing multi-metal fine particle thin film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109655A (en) * 1991-10-15 1993-04-30 Applied Materials Japan Kk CVD-sputter device
KR100751174B1 (en) 2005-07-13 2007-08-22 어플라이드 머티어리얼스, 인코포레이티드 Improved magnetron sputtering system for large-area substrates having removable anodes
JP2015501388A (en) * 2011-11-01 2015-01-15 ザ・ボーイング・カンパニーＴｈｅＢｏｅｉｎｇ Ｃｏｍｐａｎｙ Method and apparatus for deposition using atmospheric pressure plasma
US9758864B2 (en) 2011-11-01 2017-09-12 The Boeing Company Open air plasma deposition method
WO2020165959A1 (en) * 2019-02-12 2020-08-20 齊藤　公章 Method for producing multi-metal fine particles and method for producing multi-metal fine particle thin film

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