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JPS55136562A - Ultrasonic pre-soldering method and apparatus thereof - Google Patents

Ultrasonic pre-soldering method and apparatus thereof

Info

Publication number
JPS55136562A
JPS55136562A JP4206379A JP4206379A JPS55136562A JP S55136562 A JPS55136562 A JP S55136562A JP 4206379 A JP4206379 A JP 4206379A JP 4206379 A JP4206379 A JP 4206379A JP S55136562 A JPS55136562 A JP S55136562A
Authority
JP
Japan
Prior art keywords
ultrasonic horn
solder
soldered
metal substrate
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4206379A
Other languages
Japanese (ja)
Other versions
JPS6232021B2 (en
Inventor
Tadao Kushima
Tomiro Yasuda
Tasao Soga
Hiroshi Kato
Taku Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4206379A priority Critical patent/JPS55136562A/en
Publication of JPS55136562A publication Critical patent/JPS55136562A/en
Publication of JPS6232021B2 publication Critical patent/JPS6232021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H01L2224/75101—Chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83053—Bonding environment
    • H01L2224/83054—Composition of the atmosphere
    • H01L2224/83075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To obtain the pre-soldering of high quality without requiring flux by contacting the end of an ultrasonic horn to the solder surface melted on the metal surface to be pre-soldered and vibrating the same in such a manner that the ultrasonic horn does not detach from the liquid surface, in a nonoxidative atmosphere.
CONSTITUTION: Inert gas 14 such as N2 is introduced into the box 15 which contains an ultrasonic horn 13 and the metal substrate 1 to be soldered. In this atmosphere, the metal substrate 1 to be soldered, on which a solder frame 12 is placed, is placed on a heating plate 6 and the solder foil is melted. next, the ultrasonic horn 13 whose end has been heated to above the melting point of the solder foil by a heater 16 is contacted to the molten solder by a manual elevating device 18 and the ultrasonic horn is vibrated by an ultrasonic oscillator 19. This causes the solder foil 12 and the metal substrate 1 to be soldered to alloy and the soldering to be thereby accomplished.
COPYRIGHT: (C)1980,JPO&Japio
JP4206379A 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof Granted JPS55136562A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4206379A JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Publications (2)

Publication Number Publication Date
JPS55136562A true JPS55136562A (en) 1980-10-24
JPS6232021B2 JPS6232021B2 (en) 1987-07-11

Family

ID=12625634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4206379A Granted JPS55136562A (en) 1979-04-09 1979-04-09 Ultrasonic pre-soldering method and apparatus thereof

Country Status (1)

Country Link
JP (1) JPS55136562A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795639A (en) * 1980-12-04 1982-06-14 Sanyo Electric Co Ltd Forming method for preforming
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
EP1195217A1 (en) * 1999-06-11 2002-04-10 Matsushita Electric Industrial Co., Ltd. Method of soldering using lead-free solder and bonded article prepared through soldering by the method
US20110272453A1 (en) * 2010-05-05 2011-11-10 Schott Solar Ag Method and device for introducing solder onto a workpiece
CH704991A1 (en) * 2011-05-23 2012-11-30 Esec Ag Soldering method for dispensing solder on substrate when mounting semiconductor chips on metallic substrate such as leadframe involves applying ultrasonic sound to pin to produce ultrasonic waves in pin
US8573467B2 (en) 2011-05-23 2013-11-05 Esec Ag Method for dispensing solder on a substrate and method for mounting semiconductor chips

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156220A (en) * 1987-12-12 1989-06-19 Masashi Mori Supply hopper for fruit or the like

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795639A (en) * 1980-12-04 1982-06-14 Sanyo Electric Co Ltd Forming method for preforming
JPS6339096B2 (en) * 1980-12-04 1988-08-03 Sanyo Electric Co
EP1195217A1 (en) * 1999-06-11 2002-04-10 Matsushita Electric Industrial Co., Ltd. Method of soldering using lead-free solder and bonded article prepared through soldering by the method
EP1195217A4 (en) * 1999-06-11 2003-07-23 Matsushita Electric Ind Co Ltd Method of soldering using lead-free solder and bonded article prepared through soldering by the method
US6702175B1 (en) 1999-06-11 2004-03-09 Matsushita Electric Industrial Co., Ltd. Method of soldering using lead-free solder and bonded article prepared through soldering by the method
WO2001034860A1 (en) * 1999-11-08 2001-05-17 Euromat Gesellschaft Für Werkstofftechnologie Und Transfer Mbh Soldering alloy
US20110272453A1 (en) * 2010-05-05 2011-11-10 Schott Solar Ag Method and device for introducing solder onto a workpiece
CH704991A1 (en) * 2011-05-23 2012-11-30 Esec Ag Soldering method for dispensing solder on substrate when mounting semiconductor chips on metallic substrate such as leadframe involves applying ultrasonic sound to pin to produce ultrasonic waves in pin
US8573467B2 (en) 2011-05-23 2013-11-05 Esec Ag Method for dispensing solder on a substrate and method for mounting semiconductor chips

Also Published As

Publication number Publication date
JPS6232021B2 (en) 1987-07-11

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