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JPS55129472U - - Google Patents

Info

Publication number
JPS55129472U
JPS55129472U JP2982979U JP2982979U JPS55129472U JP S55129472 U JPS55129472 U JP S55129472U JP 2982979 U JP2982979 U JP 2982979U JP 2982979 U JP2982979 U JP 2982979U JP S55129472 U JPS55129472 U JP S55129472U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2982979U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2982979U priority Critical patent/JPS55129472U/ja
Publication of JPS55129472U publication Critical patent/JPS55129472U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2982979U 1979-03-07 1979-03-07 Pending JPS55129472U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2982979U JPS55129472U (ja) 1979-03-07 1979-03-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2982979U JPS55129472U (ja) 1979-03-07 1979-03-07

Publications (1)

Publication Number Publication Date
JPS55129472U true JPS55129472U (ja) 1980-09-12

Family

ID=28878335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2982979U Pending JPS55129472U (ja) 1979-03-07 1979-03-07

Country Status (1)

Country Link
JP (1) JPS55129472U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02271544A (ja) * 1989-04-12 1990-11-06 Hitachi Ltd 配線基板およびこれを用いた半導体装置
JP2006190989A (ja) * 2005-01-06 2006-07-20 Samsung Electronics Co Ltd キャリアフィルム、これを有する表示装置、及びその製造方法
JP2013145661A (ja) * 2012-01-13 2013-07-25 Tokai Rubber Ind Ltd 配線体接続構造体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02271544A (ja) * 1989-04-12 1990-11-06 Hitachi Ltd 配線基板およびこれを用いた半導体装置
JP2006190989A (ja) * 2005-01-06 2006-07-20 Samsung Electronics Co Ltd キャリアフィルム、これを有する表示装置、及びその製造方法
JP2013145661A (ja) * 2012-01-13 2013-07-25 Tokai Rubber Ind Ltd 配線体接続構造体

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