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JPS55128832A - Method of making minute pattern - Google Patents

Method of making minute pattern

Info

Publication number
JPS55128832A
JPS55128832A JP3664279A JP3664279A JPS55128832A JP S55128832 A JPS55128832 A JP S55128832A JP 3664279 A JP3664279 A JP 3664279A JP 3664279 A JP3664279 A JP 3664279A JP S55128832 A JPS55128832 A JP S55128832A
Authority
JP
Japan
Prior art keywords
opening
make
pitch
patterns
bmm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3664279A
Other languages
Japanese (ja)
Inventor
Kazuo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3664279A priority Critical patent/JPS55128832A/en
Publication of JPS55128832A publication Critical patent/JPS55128832A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To make an opening with a sharp edge when exposing a photosensitive material coated on the surface of a substrate, to light to make a prescribed pattern, by using diferent patterns and effecting overlap exposure.
CONSTITUTION: A pair of pattern chips 12a, 12b, each of which is Amm long in one side and Bmm long in the other, are placed in contact with each other on a reticle 1 to make an opening. The tips 12a, 12b are provided with main patterns 13a, 13b, which are made different from each other so that the prescribed square opening is not made until the main patterns are moved pitch by pitch and overlapped with each other. The paterns 13a, 13b are sequentially moved by a pitch of Bmm stepwise repeatedly to perform exposure to manufacture a master mask 14. Since the two different patterns 13a, 13b are overlapped with each other to make the single opening, the edge around the opening is not round but sharp.
COPYRIGHT: (C)1980,JPO&Japio
JP3664279A 1979-03-27 1979-03-27 Method of making minute pattern Pending JPS55128832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3664279A JPS55128832A (en) 1979-03-27 1979-03-27 Method of making minute pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3664279A JPS55128832A (en) 1979-03-27 1979-03-27 Method of making minute pattern

Publications (1)

Publication Number Publication Date
JPS55128832A true JPS55128832A (en) 1980-10-06

Family

ID=12475493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3664279A Pending JPS55128832A (en) 1979-03-27 1979-03-27 Method of making minute pattern

Country Status (1)

Country Link
JP (1) JPS55128832A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106128A (en) * 1980-12-24 1982-07-01 Nec Corp Forming method for pattern
JPH06137341A (en) * 1992-10-23 1994-05-17 Daikin Mfg Co Ltd Bent leaf spring and damper disk
US6559956B2 (en) * 1999-05-27 2003-05-06 Xerox Corporation Butted sensor array with supplemental chip in abutment region
JP2007205039A (en) * 2006-02-02 2007-08-16 Taisei Corp Anti-vibration floor structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57106128A (en) * 1980-12-24 1982-07-01 Nec Corp Forming method for pattern
JPH06137341A (en) * 1992-10-23 1994-05-17 Daikin Mfg Co Ltd Bent leaf spring and damper disk
US6559956B2 (en) * 1999-05-27 2003-05-06 Xerox Corporation Butted sensor array with supplemental chip in abutment region
JP2007205039A (en) * 2006-02-02 2007-08-16 Taisei Corp Anti-vibration floor structure

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