JPS55128817A - Device for bonding piece on tape - Google Patents
Device for bonding piece on tapeInfo
- Publication number
- JPS55128817A JPS55128817A JP3547379A JP3547379A JPS55128817A JP S55128817 A JPS55128817 A JP S55128817A JP 3547379 A JP3547379 A JP 3547379A JP 3547379 A JP3547379 A JP 3547379A JP S55128817 A JPS55128817 A JP S55128817A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- tape
- bonding
- bernoulli
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To surely and quickly bond a wafer without damaging it, by intermittently moving a tape, only the top of which is coated with a bonding agent and by using a Bernoulli's chuck to place the wafer on the tape and lifting up the tape by a bonding mechanism synchronously with the placing of the wafer.
CONSTITUTION: A tape 14, only the top of which is coated with a bonding agent, is intermittently moved by four pairs of rollers 15 which are provided in a tape moving mechanism and located on the obverse and reverse sides of the tape. A surface A surrounded by the rollers 15 is in a wafer bonding position. A wafer feed stage 18, on which a wafer 19 is placed, is provided near the tape 14. When the tape 14 is at rest, the wafer 19 is sucked by a Bernoulli's chuck 24 which constitutes a wafer conveying mechanism 22. After that, the arm 23 of the mechanism 22 is swung to transfer the wafer 19 to the position A. A bonding mechnaism 16 provided below the position A is operated synchronously with the transfer of the wafer to lift up the tape 14 by an upper rubber pusher 17 and fix the wafer 19.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3547379A JPS55128817A (en) | 1979-03-28 | 1979-03-28 | Device for bonding piece on tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3547379A JPS55128817A (en) | 1979-03-28 | 1979-03-28 | Device for bonding piece on tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55128817A true JPS55128817A (en) | 1980-10-06 |
Family
ID=12442740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3547379A Pending JPS55128817A (en) | 1979-03-28 | 1979-03-28 | Device for bonding piece on tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55128817A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038898A (en) * | 1983-08-11 | 1985-02-28 | 日東電工株式会社 | Method of bonding ring to thin plate |
| JPS6038897A (en) * | 1983-08-11 | 1985-02-28 | 日東電工株式会社 | Method of bonding thin plate to ring |
| JPS6121762U (en) * | 1984-07-13 | 1986-02-07 | 積水化学工業株式会社 | tape pasting machine |
| JPH01267264A (en) * | 1988-04-19 | 1989-10-25 | Nitto Denko Corp | Sticking method for thin plate and adhesive tape |
-
1979
- 1979-03-28 JP JP3547379A patent/JPS55128817A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038898A (en) * | 1983-08-11 | 1985-02-28 | 日東電工株式会社 | Method of bonding ring to thin plate |
| JPS6038897A (en) * | 1983-08-11 | 1985-02-28 | 日東電工株式会社 | Method of bonding thin plate to ring |
| JPS6313903B2 (en) * | 1983-08-11 | 1988-03-28 | Nitto Electric Ind Co | |
| JPS6337018B2 (en) * | 1983-08-11 | 1988-07-22 | Nitto Electric Ind Co | |
| JPS6121762U (en) * | 1984-07-13 | 1986-02-07 | 積水化学工業株式会社 | tape pasting machine |
| JPH0117561Y2 (en) * | 1984-07-13 | 1989-05-22 | ||
| JPH01267264A (en) * | 1988-04-19 | 1989-10-25 | Nitto Denko Corp | Sticking method for thin plate and adhesive tape |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE7614019L (en) | APPARATUS FOR MOVING A FOREMAL | |
| JPS6424440A (en) | Device for transferring and positioning flat-platelike object | |
| DE3889473D1 (en) | Device for handling a wafer. | |
| DE3855324D1 (en) | Device for positioning a wafer | |
| MY129752A (en) | Wafer planarization apparatus and planarization method thereof | |
| JPS5539021A (en) | Automatic plate tester | |
| JPS55128817A (en) | Device for bonding piece on tape | |
| JPS5720444A (en) | Feeding device for semiconductor wafer | |
| JPS5210069A (en) | Automatic apparatus for cleaning and drying wafer | |
| JPS51135052A (en) | Automatic slate transfer machine | |
| JPH0137850B2 (en) | ||
| JPS5651732A (en) | Exposure processing method | |
| JPS5456356A (en) | Dicing device | |
| JPS6443419A (en) | Supply device for hybrid integrated circuit substrate where duplex printing is effected | |
| JPS6457633A (en) | Suction transfer device | |
| JPS5218663A (en) | Automatic device for transferring plate material | |
| JPS577135A (en) | Wire bonding apparatus | |
| JPS5798419A (en) | Device for displacing work | |
| JPS6469204A (en) | Semiconductor wafer cassette transfer device | |
| JPS5582444A (en) | Manufacture of semiconductor device | |
| JPS6425549A (en) | Transfer apparatus | |
| JPS5480974A (en) | Method of transferring laminar body | |
| JPS5574145A (en) | Semiconductor frame aligning apparatus | |
| JPS5776835A (en) | Apparatus for applying liquid on semiconductor substrate | |
| JPS5213278A (en) | Floating conveyor |