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JPS55115347A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55115347A
JPS55115347A JP2169779A JP2169779A JPS55115347A JP S55115347 A JPS55115347 A JP S55115347A JP 2169779 A JP2169779 A JP 2169779A JP 2169779 A JP2169779 A JP 2169779A JP S55115347 A JPS55115347 A JP S55115347A
Authority
JP
Japan
Prior art keywords
frame
base body
square frame
brazed
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2169779A
Other languages
Japanese (ja)
Other versions
JPS6136708B2 (en
Inventor
Shigeru Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP2169779A priority Critical patent/JPS55115347A/en
Publication of JPS55115347A publication Critical patent/JPS55115347A/en
Publication of JPS6136708B2 publication Critical patent/JPS6136708B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To stabilize the brazing work for a large-sized square frame by providing a step on the ceramic base body at a distance of the frame thickness from the outer edge of the square frame which is brazed to the base body.
CONSTITUTION: The square frame 24 is brazed to the surface of the ceramic base body 21, the step 21-1 is formed in the surface of base body at a distance of the frame thickness from the outer edge of the frame. The metal cover 23 is electrically attached to the frame 24 by means of a roller electrode. Although the roller electrode with a greater angle B is used, the electrode edge is not made contact with the face of ceramic body since the step is formed. Accordingly a metal cover can stably be brazed to a large-sized square frame without making the angle B smaller.
COPYRIGHT: (C)1980,JPO&Japio
JP2169779A 1979-02-26 1979-02-26 Semiconductor device Granted JPS55115347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2169779A JPS55115347A (en) 1979-02-26 1979-02-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2169779A JPS55115347A (en) 1979-02-26 1979-02-26 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55115347A true JPS55115347A (en) 1980-09-05
JPS6136708B2 JPS6136708B2 (en) 1986-08-20

Family

ID=12062254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2169779A Granted JPS55115347A (en) 1979-02-26 1979-02-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55115347A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944187A (en) * 1988-12-23 1990-07-31 Rosemount Inc. Multimodulus pressure sensor

Also Published As

Publication number Publication date
JPS6136708B2 (en) 1986-08-20

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