JPS55110117A - Epoxy resin hardener - Google Patents
Epoxy resin hardenerInfo
- Publication number
- JPS55110117A JPS55110117A JP1877979A JP1877979A JPS55110117A JP S55110117 A JPS55110117 A JP S55110117A JP 1877979 A JP1877979 A JP 1877979A JP 1877979 A JP1877979 A JP 1877979A JP S55110117 A JPS55110117 A JP S55110117A
- Authority
- JP
- Japan
- Prior art keywords
- acids
- epoxy resin
- types
- flexibilizing
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE: An epoxy resin hardener capable of giving hardened resins having improved thermal shock resistance, with flexibilizing effect and a low melting point, comprising a polycarboxylic acid anhydride obtained by copolymerizing plural types of aliphatic dibasis acids.
CONSTITUTION: A flexibilizing hardener for epoxy resin comprising a polycarboxylic acid anhydride obtained by copolymerizing two or more types of aliphatic dibasic acids, e.g. malonic, glutaric, and adipic acids. The acids may be combined with other alicyclic or aromatic acid anhydrides to provide the synergistic effect of low melting with performance in use.
USE: All types of epoxy resins to be used for coating materials, adhesives, and casting and impregnation of electric parts.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1877979A JPS55110117A (en) | 1979-02-19 | 1979-02-19 | Epoxy resin hardener |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1877979A JPS55110117A (en) | 1979-02-19 | 1979-02-19 | Epoxy resin hardener |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55110117A true JPS55110117A (en) | 1980-08-25 |
| JPS6159327B2 JPS6159327B2 (en) | 1986-12-16 |
Family
ID=11981111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1877979A Granted JPS55110117A (en) | 1979-02-19 | 1979-02-19 | Epoxy resin hardener |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55110117A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009088059A1 (en) * | 2008-01-09 | 2009-07-16 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| JP2010100798A (en) * | 2008-01-09 | 2010-05-06 | Hitachi Chem Co Ltd | Thermosetting resin composition, epoxy resin molding material, substrate for mounting photosemiconductor element, method for manufacturing the same and photosemiconductor device |
| JP2010106226A (en) * | 2008-01-11 | 2010-05-13 | Hitachi Chem Co Ltd | Polycarboxylic acid condensate and epoxy resin curing agent using the same, epoxy resin composition, polyamide resin, and polyester resin |
| JP2011213948A (en) * | 2010-04-01 | 2011-10-27 | Hitachi Chem Co Ltd | Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting optical semiconductor element and method for manufacturing the substrate, and optical semiconductor device |
| US8637593B2 (en) | 2008-01-09 | 2014-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
-
1979
- 1979-02-19 JP JP1877979A patent/JPS55110117A/en active Granted
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009088059A1 (en) * | 2008-01-09 | 2009-07-16 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| JP2010100798A (en) * | 2008-01-09 | 2010-05-06 | Hitachi Chem Co Ltd | Thermosetting resin composition, epoxy resin molding material, substrate for mounting photosemiconductor element, method for manufacturing the same and photosemiconductor device |
| JP4586925B2 (en) * | 2008-01-09 | 2010-11-24 | 日立化成工業株式会社 | Thermosetting resin composition, epoxy resin molding material, substrate for mounting optical semiconductor element, manufacturing method thereof, and optical semiconductor device |
| US8585272B2 (en) | 2008-01-09 | 2013-11-19 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| US8637593B2 (en) | 2008-01-09 | 2014-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| TWI452056B (en) * | 2008-01-09 | 2014-09-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| US9067906B2 (en) | 2008-01-09 | 2015-06-30 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| JP2010106226A (en) * | 2008-01-11 | 2010-05-13 | Hitachi Chem Co Ltd | Polycarboxylic acid condensate and epoxy resin curing agent using the same, epoxy resin composition, polyamide resin, and polyester resin |
| JP2011213948A (en) * | 2010-04-01 | 2011-10-27 | Hitachi Chem Co Ltd | Polycarboxylic acid condensate, thermosetting resin composition, substrate for mounting optical semiconductor element and method for manufacturing the substrate, and optical semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6159327B2 (en) | 1986-12-16 |
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