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JPS55107237A - Resin molding method and device - Google Patents

Resin molding method and device

Info

Publication number
JPS55107237A
JPS55107237A JP1335279A JP1335279A JPS55107237A JP S55107237 A JPS55107237 A JP S55107237A JP 1335279 A JP1335279 A JP 1335279A JP 1335279 A JP1335279 A JP 1335279A JP S55107237 A JPS55107237 A JP S55107237A
Authority
JP
Japan
Prior art keywords
resin
mold
flowpath
plunger
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1335279A
Other languages
Japanese (ja)
Inventor
Isao Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1335279A priority Critical patent/JPS55107237A/en
Publication of JPS55107237A publication Critical patent/JPS55107237A/en
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To improve the utilization efficiency of a material by crushing a flowpath filled with a resin in the final stage of the resin pressure forming operation to forcibly press the resin within the flowpath.
CONSTITUTION: A work 38 is placed on a lower mold 24 and mold-clamped. Thereafter, resin tablets are supplied from the cylinder part of a upper mold 25 to cause a plunger 33 to descend. A resin 40 in a softened molten state is pressed and flows into a mold space 42 through a flowpath 41. The resin tablets are adjusted so that a remaining space 43 exists in a mold space 42 when the plunger 33 has completely descended. Then, when a plunger 34 is caused to descend and a plate 35 infiltrates in a flowpath 41, a resin 40 is extruded to fill the remaining space 43 therewith. After thermosetting the resin, the mold is opened, and a molded product 44 and an unnessary resin mass 45 are taken out. According to this organization, generation of unfilled resin powders and that of pinholes or voids can be prevented.
COPYRIGHT: (C)1980,JPO&Japio
JP1335279A 1979-02-09 1979-02-09 Resin molding method and device Pending JPS55107237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1335279A JPS55107237A (en) 1979-02-09 1979-02-09 Resin molding method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1335279A JPS55107237A (en) 1979-02-09 1979-02-09 Resin molding method and device

Publications (1)

Publication Number Publication Date
JPS55107237A true JPS55107237A (en) 1980-08-16

Family

ID=11830700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1335279A Pending JPS55107237A (en) 1979-02-09 1979-02-09 Resin molding method and device

Country Status (1)

Country Link
JP (1) JPS55107237A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201429A (en) * 1983-04-28 1984-11-15 Toshiba Corp Semiconductor resin sealing apparatus
JPH08197568A (en) * 1995-01-25 1996-08-06 Nec Corp Molding die and resin encapsulation of semiconductor device
JP2009000825A (en) * 2007-06-19 2009-01-08 Daiichi Seiko Kk Resin sealing device, moving member, and resin sealing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201429A (en) * 1983-04-28 1984-11-15 Toshiba Corp Semiconductor resin sealing apparatus
JPH08197568A (en) * 1995-01-25 1996-08-06 Nec Corp Molding die and resin encapsulation of semiconductor device
JP2009000825A (en) * 2007-06-19 2009-01-08 Daiichi Seiko Kk Resin sealing device, moving member, and resin sealing method

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