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JPS55105339A - Ultrasonic bonding method - Google Patents

Ultrasonic bonding method

Info

Publication number
JPS55105339A
JPS55105339A JP1219779A JP1219779A JPS55105339A JP S55105339 A JPS55105339 A JP S55105339A JP 1219779 A JP1219779 A JP 1219779A JP 1219779 A JP1219779 A JP 1219779A JP S55105339 A JPS55105339 A JP S55105339A
Authority
JP
Japan
Prior art keywords
horn
oscillator
ultrasonic
semiconductor substrate
abnormality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1219779A
Other languages
Japanese (ja)
Inventor
Akira Kuromaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1219779A priority Critical patent/JPS55105339A/en
Publication of JPS55105339A publication Critical patent/JPS55105339A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To keep the connection always accurate by measuring the vibration of a semiconductor substrate in connecting bonding wire to the electrode on the semiconductor substrate by using an ultrasonic horn, and controlling an oscillator which drives the horn if there is abnormality.
CONSTITUTION: A vibrator 2 having an ultrasonic horn 4 at its tip is driven by using an ultrasonic oscillator 1. Bonding wire 9 which is threaded through a hole 8 at the tip of the horn 4 is bonded to the electrode of a semiconductor substrate 7 which is placed on a work stage 6. At this time, a sensor 10 comprising a piezoelectric element which is supported on a moving lever 11 near the substrate 7 is arranged and is followed to the action of the horn 4. The vibrating output is added to a comparator 14 through a vibration sensor 12 and a differential and integrating device 13. Then, the result of the comparison is judged by a judging device 15. If there is any abnormality, an abnormality indicating signal is sent to the ultrasonic oscillator 1 to change the oscillating conditions of the oscillator 1, thereby the result is memorized in a memory device 18.
COPYRIGHT: (C)1980,JPO&Japio
JP1219779A 1979-02-07 1979-02-07 Ultrasonic bonding method Pending JPS55105339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1219779A JPS55105339A (en) 1979-02-07 1979-02-07 Ultrasonic bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1219779A JPS55105339A (en) 1979-02-07 1979-02-07 Ultrasonic bonding method

Publications (1)

Publication Number Publication Date
JPS55105339A true JPS55105339A (en) 1980-08-12

Family

ID=11798671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1219779A Pending JPS55105339A (en) 1979-02-07 1979-02-07 Ultrasonic bonding method

Country Status (1)

Country Link
JP (1) JPS55105339A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117743A (en) * 1983-11-30 1985-06-25 Toshiba Corp Method of judgement for junction state in wire bonding
JPS6231134A (en) * 1985-08-01 1987-02-10 Toshiba Corp Supersonic wire bonding method
US5116783A (en) * 1989-01-13 1992-05-26 Mitsubishi Denki Kabushiki Kaisha Method of producing semiconductor device
US5229646A (en) * 1989-01-13 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a copper wires ball bonded to aluminum electrodes
JPH0685014A (en) * 1993-07-30 1994-03-25 Toshiba Corp Wire bonding device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473562A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473562A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Wire bonding device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117743A (en) * 1983-11-30 1985-06-25 Toshiba Corp Method of judgement for junction state in wire bonding
JPS6231134A (en) * 1985-08-01 1987-02-10 Toshiba Corp Supersonic wire bonding method
US5116783A (en) * 1989-01-13 1992-05-26 Mitsubishi Denki Kabushiki Kaisha Method of producing semiconductor device
US5229646A (en) * 1989-01-13 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a copper wires ball bonded to aluminum electrodes
JPH0685014A (en) * 1993-07-30 1994-03-25 Toshiba Corp Wire bonding device

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