JPS55100134A - Injection-type forming of sandwich-structured body - Google Patents
Injection-type forming of sandwich-structured bodyInfo
- Publication number
- JPS55100134A JPS55100134A JP560979A JP560979A JPS55100134A JP S55100134 A JPS55100134 A JP S55100134A JP 560979 A JP560979 A JP 560979A JP 560979 A JP560979 A JP 560979A JP S55100134 A JPS55100134 A JP S55100134A
- Authority
- JP
- Japan
- Prior art keywords
- width
- lower side
- pair
- synthetic resin
- broad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005187 foaming Methods 0.000 abstract 3
- 239000000470 constituent Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229920003002 synthetic resin Polymers 0.000 abstract 2
- 239000000057 synthetic resin Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To enhance mass productivity and size precision by injecting foaming synthetic resin solution into space formed by upper and lower side constituent members and a pair of right and left side molds and cutting and finishing a cured formed resin to a prearranged width.
CONSTITUTION: Upper and lower side material 11 which become upper and lower side constituent members are formed at least in the same width as the central maximum width or a broad equiwidth W1. In addition, a pair of right and left side walls 13, 13 which are preformed to the thickness dimensional distribution of the center are caused to intervene, at least, with the same width as the central maximum width or broad equally-opposed clearance W2. After this process, foaming synthetic resin solution 15 is injected into space 14 formed by surrounding materials 11, 12 and side molds 13, 13. After foaming and curing, press-clamping is released and formed body 10 thus obtained is cut and finished to a prearranged width dimensional distribution.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP560979A JPS55100134A (en) | 1979-01-23 | 1979-01-23 | Injection-type forming of sandwich-structured body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP560979A JPS55100134A (en) | 1979-01-23 | 1979-01-23 | Injection-type forming of sandwich-structured body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55100134A true JPS55100134A (en) | 1980-07-30 |
| JPS6362228B2 JPS6362228B2 (en) | 1988-12-01 |
Family
ID=11615937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP560979A Granted JPS55100134A (en) | 1979-01-23 | 1979-01-23 | Injection-type forming of sandwich-structured body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55100134A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7075407B1 (en) | 1999-04-09 | 2006-07-11 | Murata Manufacturing Co., Ltd. | Temperature sensor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50122338A (en) * | 1974-03-11 | 1975-09-25 |
-
1979
- 1979-01-23 JP JP560979A patent/JPS55100134A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50122338A (en) * | 1974-03-11 | 1975-09-25 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7075407B1 (en) | 1999-04-09 | 2006-07-11 | Murata Manufacturing Co., Ltd. | Temperature sensor |
| US7193498B2 (en) | 1999-04-09 | 2007-03-20 | Murata Manufacturing Co., Ltd. | Method of producing temperature sensor and mounting same to a circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6362228B2 (en) | 1988-12-01 |
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