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JPS5498630A - Production of liquid crystal cells - Google Patents

Production of liquid crystal cells

Info

Publication number
JPS5498630A
JPS5498630A JP15317977A JP15317977A JPS5498630A JP S5498630 A JPS5498630 A JP S5498630A JP 15317977 A JP15317977 A JP 15317977A JP 15317977 A JP15317977 A JP 15317977A JP S5498630 A JPS5498630 A JP S5498630A
Authority
JP
Japan
Prior art keywords
liquid crystal
external connection
grooves
substrate
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15317977A
Other languages
Japanese (ja)
Inventor
Mitsutoshi Nakamura
Akio Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP15317977A priority Critical patent/JPS5498630A/en
Publication of JPS5498630A publication Critical patent/JPS5498630A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Clocks (AREA)
  • Liquid Crystal (AREA)

Abstract

PURPOSE: To obtain a larger display area within a limited size of liquid crystal cell and enhance the reliability of electrode group for external connection, by providing electrodes for external connection in the vicinity of grooves formed in a glass substrate at specified intervals.
CONSTITUTION: Grooves 1a are processed at specifed intervals in a glass substrate 1 for multiple portions, and segment electrodes are provided on the substrate 1. Spacers 3 made from low melting point sealing glass or the like are printed thereon, and the spacers 3 are heated and melted, being pressed against a glass substrate 6 for multiple portions having counter segment electrodes 5 provided. Thus, the substrates 1 and 6 are sealed and bonded together. Then, liquid crystal substance 4 is injected and sealed. Next, the parts of substrates 1, 6 corresponding to the positions of grooves 1a are cut off. On the side part 1c of the substrate 1 of liquid crystal cell separated individually, a conductive film 7a is deposited, and a conductive film 7b is also deposited on the outer surface part 1d as required. Thus, an electrode for external connection 7 is formed by films 7a, 7b.
COPYRIGHT: (C)1979,JPO&Japio
JP15317977A 1977-12-20 1977-12-20 Production of liquid crystal cells Pending JPS5498630A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15317977A JPS5498630A (en) 1977-12-20 1977-12-20 Production of liquid crystal cells

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15317977A JPS5498630A (en) 1977-12-20 1977-12-20 Production of liquid crystal cells

Publications (1)

Publication Number Publication Date
JPS5498630A true JPS5498630A (en) 1979-08-03

Family

ID=15556767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15317977A Pending JPS5498630A (en) 1977-12-20 1977-12-20 Production of liquid crystal cells

Country Status (1)

Country Link
JP (1) JPS5498630A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497258A (en) * 1994-05-27 1996-03-05 The Regents Of The University Of Colorado Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5497258A (en) * 1994-05-27 1996-03-05 The Regents Of The University Of Colorado Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning

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