JPS549767A - Substrate for multiilayer wiring - Google Patents
Substrate for multiilayer wiringInfo
- Publication number
- JPS549767A JPS549767A JP7573477A JP7573477A JPS549767A JP S549767 A JPS549767 A JP S549767A JP 7573477 A JP7573477 A JP 7573477A JP 7573477 A JP7573477 A JP 7573477A JP S549767 A JPS549767 A JP S549767A
- Authority
- JP
- Japan
- Prior art keywords
- multiilayer
- wiring
- substrate
- multiilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7573477A JPS549767A (en) | 1977-06-24 | 1977-06-24 | Substrate for multiilayer wiring |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7573477A JPS549767A (en) | 1977-06-24 | 1977-06-24 | Substrate for multiilayer wiring |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS549767A true JPS549767A (en) | 1979-01-24 |
Family
ID=13584789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7573477A Pending JPS549767A (en) | 1977-06-24 | 1977-06-24 | Substrate for multiilayer wiring |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS549767A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55105398A (en) * | 1979-02-08 | 1980-08-12 | Cho Lsi Gijutsu Kenkyu Kumiai | High packing density multilayer circuit board |
JPS6035598A (en) * | 1983-04-22 | 1985-02-23 | クレイ リサーチ,インコーポレイテイド | Circuit module with high cooling efficiency |
JPS6138997U (en) * | 1984-08-10 | 1986-03-11 | イビデン株式会社 | Board for mounting electronic components |
JPS6158297A (en) * | 1984-08-29 | 1986-03-25 | 沖電気工業株式会社 | Multilayer printed circuit board |
JPS63131560A (en) * | 1986-11-17 | 1988-06-03 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Chip joint structure |
JPS6395278U (en) * | 1986-12-11 | 1988-06-20 | ||
JPH02232992A (en) * | 1989-03-06 | 1990-09-14 | Nippon Telegr & Teleph Corp <Ntt> | Electronic circuit module |
JPH0497552A (en) * | 1990-08-14 | 1992-03-30 | Matsushita Electric Works Ltd | Heat dissipation type semiconductor package |
JPH04291999A (en) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | Part cooling structure |
-
1977
- 1977-06-24 JP JP7573477A patent/JPS549767A/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0121638B2 (en) * | 1979-02-08 | 1989-04-21 | Cho Eru Esu Ai Gijutsu Kenkyu Kumiai | |
JPS55105398A (en) * | 1979-02-08 | 1980-08-12 | Cho Lsi Gijutsu Kenkyu Kumiai | High packing density multilayer circuit board |
JPS6035598A (en) * | 1983-04-22 | 1985-02-23 | クレイ リサーチ,インコーポレイテイド | Circuit module with high cooling efficiency |
JPH0552079B2 (en) * | 1983-04-22 | 1993-08-04 | Kurei Risaachi Inc | |
JPS6138997U (en) * | 1984-08-10 | 1986-03-11 | イビデン株式会社 | Board for mounting electronic components |
JPH056714Y2 (en) * | 1984-08-10 | 1993-02-19 | ||
JPS6158297A (en) * | 1984-08-29 | 1986-03-25 | 沖電気工業株式会社 | Multilayer printed circuit board |
JPH0239101B2 (en) * | 1986-11-17 | 1990-09-04 | Intaanashonaru Bijinesu Mashiinzu Corp | |
JPS63131560A (en) * | 1986-11-17 | 1988-06-03 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | Chip joint structure |
JPS6395278U (en) * | 1986-12-11 | 1988-06-20 | ||
JPH02232992A (en) * | 1989-03-06 | 1990-09-14 | Nippon Telegr & Teleph Corp <Ntt> | Electronic circuit module |
JPH0497552A (en) * | 1990-08-14 | 1992-03-30 | Matsushita Electric Works Ltd | Heat dissipation type semiconductor package |
JPH04291999A (en) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | Part cooling structure |
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