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JPS548974A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS548974A
JPS548974A JP7519077A JP7519077A JPS548974A JP S548974 A JPS548974 A JP S548974A JP 7519077 A JP7519077 A JP 7519077A JP 7519077 A JP7519077 A JP 7519077A JP S548974 A JPS548974 A JP S548974A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
jig
cracking
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7519077A
Other languages
Japanese (ja)
Inventor
Keiji Itoga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7519077A priority Critical patent/JPS548974A/en
Publication of JPS548974A publication Critical patent/JPS548974A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent pellets from cracking by temporarily press-fitting a pellet mounted on a solder piece by a jig which contacts only an electrode surface.
COPYRIGHT: (C)1979,JPO&Japio
JP7519077A 1977-06-23 1977-06-23 Manufacture of semiconductor device Pending JPS548974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7519077A JPS548974A (en) 1977-06-23 1977-06-23 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7519077A JPS548974A (en) 1977-06-23 1977-06-23 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS548974A true JPS548974A (en) 1979-01-23

Family

ID=13569021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7519077A Pending JPS548974A (en) 1977-06-23 1977-06-23 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS548974A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61228713A (en) * 1985-03-29 1986-10-11 ノーザン・テレコム・リミテツド Saw apparatus and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61228713A (en) * 1985-03-29 1986-10-11 ノーザン・テレコム・リミテツド Saw apparatus and manufacture thereof

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