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JPS547862A - Electrode forming method - Google Patents

Electrode forming method

Info

Publication number
JPS547862A
JPS547862A JP7281377A JP7281377A JPS547862A JP S547862 A JPS547862 A JP S547862A JP 7281377 A JP7281377 A JP 7281377A JP 7281377 A JP7281377 A JP 7281377A JP S547862 A JPS547862 A JP S547862A
Authority
JP
Japan
Prior art keywords
forming method
electrode forming
forming
gold
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7281377A
Other languages
Japanese (ja)
Inventor
Genichi Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7281377A priority Critical patent/JPS547862A/en
Publication of JPS547862A publication Critical patent/JPS547862A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To prevent copper ions from being dissolved into gold plating solution, by forming gold layer with electrolytic plating method, after forming the gold layer on the copper layer with non-electrolytic plating method, in forming projection electrode for extermal drawing of a semiconductor element.
COPYRIGHT: (C)1979,JPO&Japio
JP7281377A 1977-06-21 1977-06-21 Electrode forming method Pending JPS547862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7281377A JPS547862A (en) 1977-06-21 1977-06-21 Electrode forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7281377A JPS547862A (en) 1977-06-21 1977-06-21 Electrode forming method

Publications (1)

Publication Number Publication Date
JPS547862A true JPS547862A (en) 1979-01-20

Family

ID=13500213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7281377A Pending JPS547862A (en) 1977-06-21 1977-06-21 Electrode forming method

Country Status (1)

Country Link
JP (1) JPS547862A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238054A (en) * 1975-09-16 1977-03-24 Tokyo Fuudo Kemikaru Kk Method of storing fruit
JPS5618540A (en) * 1979-07-26 1981-02-21 Riken Vitamin Co Ltd Preservation of bird egg

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5238054A (en) * 1975-09-16 1977-03-24 Tokyo Fuudo Kemikaru Kk Method of storing fruit
JPS5424455B2 (en) * 1975-09-16 1979-08-21
JPS5618540A (en) * 1979-07-26 1981-02-21 Riken Vitamin Co Ltd Preservation of bird egg

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