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JPS5450269A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5450269A
JPS5450269A JP11716777A JP11716777A JPS5450269A JP S5450269 A JPS5450269 A JP S5450269A JP 11716777 A JP11716777 A JP 11716777A JP 11716777 A JP11716777 A JP 11716777A JP S5450269 A JPS5450269 A JP S5450269A
Authority
JP
Japan
Prior art keywords
melting point
solder layer
tin
silver
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11716777A
Other languages
Japanese (ja)
Inventor
Koichi Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP11716777A priority Critical patent/JPS5450269A/en
Publication of JPS5450269A publication Critical patent/JPS5450269A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To mount pellets to a substrate by sandwiching a high melting point solder layer with low melting point solder layers.
CONSTITUTION: Low melting point solder layers 2b, 2b' of 200 to 220°C in melting point mainly composed of silver and tin are laminated on the front and back of a high melting point solder layer 2a of 300 to 350°C in melting point mainly composed of silver, tin and lead. When the solder layers 2 are heated at 200 to 220°C on a substrate 1, a pellet 3 is bonded at a uniform thickness by the high temperature solder layer 2a, thus it does not bocome brittle owing to thermal fatigue despite long term operation
COPYRIGHT: (C)1979,JPO&Japio
JP11716777A 1977-09-28 1977-09-28 Semiconductor device Pending JPS5450269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11716777A JPS5450269A (en) 1977-09-28 1977-09-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11716777A JPS5450269A (en) 1977-09-28 1977-09-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5450269A true JPS5450269A (en) 1979-04-20

Family

ID=14705099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11716777A Pending JPS5450269A (en) 1977-09-28 1977-09-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5450269A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176244A (en) * 1984-02-22 1985-09-10 Sumitomo Electric Ind Ltd Adhesive part of semiconductor device
US4677741A (en) * 1981-11-30 1987-07-07 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing package for high power integrated circuit
JPS63155732A (en) * 1986-12-19 1988-06-28 Agency Of Ind Science & Technol Semiconductor device
US5470787A (en) * 1994-05-02 1995-11-28 Motorola, Inc. Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same
WO2001091176A3 (en) * 2000-05-23 2002-04-18 Unitive Electronics Inc Trilayer/bilayer solder bumps and fabrication methods therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51118372A (en) * 1975-04-10 1976-10-18 Hitachi Cable Ltd Solder for semiconductor unit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51118372A (en) * 1975-04-10 1976-10-18 Hitachi Cable Ltd Solder for semiconductor unit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677741A (en) * 1981-11-30 1987-07-07 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing package for high power integrated circuit
JPS60176244A (en) * 1984-02-22 1985-09-10 Sumitomo Electric Ind Ltd Adhesive part of semiconductor device
JPS63155732A (en) * 1986-12-19 1988-06-28 Agency Of Ind Science & Technol Semiconductor device
JPH0325933B2 (en) * 1986-12-19 1991-04-09 Kogyo Gijutsuin
US5470787A (en) * 1994-05-02 1995-11-28 Motorola, Inc. Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same
WO2001091176A3 (en) * 2000-05-23 2002-04-18 Unitive Electronics Inc Trilayer/bilayer solder bumps and fabrication methods therefor
US6492197B1 (en) 2000-05-23 2002-12-10 Unitive Electronics Inc. Trilayer/bilayer solder bumps and fabrication methods therefor

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