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JPS5444868A - Manufacture of semiconductor and lead_frame header connector used for it - Google Patents

Manufacture of semiconductor and lead_frame header connector used for it

Info

Publication number
JPS5444868A
JPS5444868A JP10394778A JP10394778A JPS5444868A JP S5444868 A JPS5444868 A JP S5444868A JP 10394778 A JP10394778 A JP 10394778A JP 10394778 A JP10394778 A JP 10394778A JP S5444868 A JPS5444868 A JP S5444868A
Authority
JP
Japan
Prior art keywords
header
distortion
lead
frame
turning direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10394778A
Other languages
Japanese (ja)
Inventor
Yuji Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10394778A priority Critical patent/JPS5444868A/en
Publication of JPS5444868A publication Critical patent/JPS5444868A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To absorb distortion in the turning direction by heating a connector after caulking the tip of a protrusion of a pellet-connecting header or lead frame, inserted into the other through hole, at only two points.
CONSTITUTION: Caulking protrusions 6 provided diagonally to two points of header 7 are inserted into corresponding holes 5 of header-hanging L-shaped bent lead 4 and then caulked, thereby fitting header 7 to lead frame 1. As a result, distortion in the turning direction generated between the frame and header can be absorbed through the movement in the turning direction centering on two caulked part 6. Making hole 5 oval makes it possible to absorb vertical distortion at the same time and distortion during a heat treatment is absorbed sufficiently, so that the contact of the header due to the curvature of the frame can be prevented.
COPYRIGHT: (C)1979,JPO&Japio
JP10394778A 1978-08-28 1978-08-28 Manufacture of semiconductor and lead_frame header connector used for it Pending JPS5444868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10394778A JPS5444868A (en) 1978-08-28 1978-08-28 Manufacture of semiconductor and lead_frame header connector used for it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10394778A JPS5444868A (en) 1978-08-28 1978-08-28 Manufacture of semiconductor and lead_frame header connector used for it

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP49102094A Division JPS5928985B2 (en) 1974-09-06 1974-09-06 How to connect metal substrates

Publications (1)

Publication Number Publication Date
JPS5444868A true JPS5444868A (en) 1979-04-09

Family

ID=14367624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10394778A Pending JPS5444868A (en) 1978-08-28 1978-08-28 Manufacture of semiconductor and lead_frame header connector used for it

Country Status (1)

Country Link
JP (1) JPS5444868A (en)

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