JPS5444868A - Manufacture of semiconductor and lead_frame header connector used for it - Google Patents
Manufacture of semiconductor and lead_frame header connector used for itInfo
- Publication number
- JPS5444868A JPS5444868A JP10394778A JP10394778A JPS5444868A JP S5444868 A JPS5444868 A JP S5444868A JP 10394778 A JP10394778 A JP 10394778A JP 10394778 A JP10394778 A JP 10394778A JP S5444868 A JPS5444868 A JP S5444868A
- Authority
- JP
- Japan
- Prior art keywords
- header
- distortion
- lead
- frame
- turning direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To absorb distortion in the turning direction by heating a connector after caulking the tip of a protrusion of a pellet-connecting header or lead frame, inserted into the other through hole, at only two points.
CONSTITUTION: Caulking protrusions 6 provided diagonally to two points of header 7 are inserted into corresponding holes 5 of header-hanging L-shaped bent lead 4 and then caulked, thereby fitting header 7 to lead frame 1. As a result, distortion in the turning direction generated between the frame and header can be absorbed through the movement in the turning direction centering on two caulked part 6. Making hole 5 oval makes it possible to absorb vertical distortion at the same time and distortion during a heat treatment is absorbed sufficiently, so that the contact of the header due to the curvature of the frame can be prevented.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10394778A JPS5444868A (en) | 1978-08-28 | 1978-08-28 | Manufacture of semiconductor and lead_frame header connector used for it |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10394778A JPS5444868A (en) | 1978-08-28 | 1978-08-28 | Manufacture of semiconductor and lead_frame header connector used for it |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49102094A Division JPS5928985B2 (en) | 1974-09-06 | 1974-09-06 | How to connect metal substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5444868A true JPS5444868A (en) | 1979-04-09 |
Family
ID=14367624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10394778A Pending JPS5444868A (en) | 1978-08-28 | 1978-08-28 | Manufacture of semiconductor and lead_frame header connector used for it |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5444868A (en) |
-
1978
- 1978-08-28 JP JP10394778A patent/JPS5444868A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS51131274A (en) | Tip bonding method | |
JPS536560A (en) | Manufacture of cathode for direct heating type cathode ray tube | |
JPS51134884A (en) | Manufacturing method of electric cable | |
JPS5337383A (en) | Semiconductor integrated circuit | |
JPS53105177A (en) | Manufacture of semiconductor device | |
JPS5444868A (en) | Manufacture of semiconductor and lead_frame header connector used for it | |
JPS521364A (en) | Toggle | |
JPS5211769A (en) | Method of adhering semiconductor proper and semiconductor holder | |
JPS5434107A (en) | Fixing process of wafter | |
JPS52127496A (en) | Removal of trace amounts of halogen in sulfuric acid | |
JPS522281A (en) | Method of making semiconductor devices | |
JPS51126020A (en) | Micro program control equipment | |
JPS5294073A (en) | Leading-in frame and process for preparing it | |
JPS55128571A (en) | Treatment for nonelectrolytically nickel-plated surface to be soldered | |
JPS5327357A (en) | Direct heating cathode | |
JPS53131267A (en) | Fixing method | |
JPS5394874A (en) | Connecting method for semiconductor device | |
JPS5437574A (en) | Fabrication method of semiconductor pellet | |
JPS5443456A (en) | Low fusing-point glass sealing lead | |
JPS5243566A (en) | Adornment | |
JPS5259343A (en) | High frequency heater | |
JPS54108502A (en) | Connection method between chassis and shield plate of tuner | |
JPS51137890A (en) | Terminal fixing apparatus | |
JPS5459658A (en) | Thermomedium encapsulating method of heat pipe roller used in copying machine etc. | |
JPS5338692A (en) | 7-amino-3-halo-3-cephem-4-carboxylic acids |