JPS5436031B2 - - Google Patents
Info
- Publication number
- JPS5436031B2 JPS5436031B2 JP8993975A JP8993975A JPS5436031B2 JP S5436031 B2 JPS5436031 B2 JP S5436031B2 JP 8993975 A JP8993975 A JP 8993975A JP 8993975 A JP8993975 A JP 8993975A JP S5436031 B2 JPS5436031 B2 JP S5436031B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50089939A JPS5213772A (en) | 1975-07-22 | 1975-07-22 | Ic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50089939A JPS5213772A (en) | 1975-07-22 | 1975-07-22 | Ic package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5213772A JPS5213772A (en) | 1977-02-02 |
| JPS5436031B2 true JPS5436031B2 (en) | 1979-11-07 |
Family
ID=13984658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50089939A Granted JPS5213772A (en) | 1975-07-22 | 1975-07-22 | Ic package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5213772A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215749A (en) * | 1983-05-24 | 1984-12-05 | Nippon Telegr & Teleph Corp <Ntt> | Low noise package for semiconductor integrated circuit |
| JPS6045045A (en) * | 1983-08-23 | 1985-03-11 | Shinko Electric Ind Co Ltd | Multilayer ceramic package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3400456A (en) * | 1965-08-30 | 1968-09-10 | Western Electric Co | Methods of manufacturing thin film components |
| US3423517A (en) * | 1966-07-27 | 1969-01-21 | Dielectric Systems Inc | Monolithic ceramic electrical interconnecting structure |
| JPS5228547B2 (en) * | 1972-07-10 | 1977-07-27 | ||
| JPS5029281A (en) * | 1973-07-20 | 1975-03-25 |
-
1975
- 1975-07-22 JP JP50089939A patent/JPS5213772A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5213772A (en) | 1977-02-02 |