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JPS5422759A - Handling method for semiconductor wafer - Google Patents

Handling method for semiconductor wafer

Info

Publication number
JPS5422759A
JPS5422759A JP8739277A JP8739277A JPS5422759A JP S5422759 A JPS5422759 A JP S5422759A JP 8739277 A JP8739277 A JP 8739277A JP 8739277 A JP8739277 A JP 8739277A JP S5422759 A JPS5422759 A JP S5422759A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
handling method
wafer
dicing
contamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8739277A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
Osamu Sumiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8739277A priority Critical patent/JPS5422759A/en
Publication of JPS5422759A publication Critical patent/JPS5422759A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To ensure an isolation process without any contamination of the wafer by carrying out the breaking and other processes for the semiconductor wafer in a state under which the main surface of the semiconductor wafer of the dicing, etc. is protected by a sheet.
COPYRIGHT: (C)1979,JPO&Japio
JP8739277A 1977-07-22 1977-07-22 Handling method for semiconductor wafer Pending JPS5422759A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8739277A JPS5422759A (en) 1977-07-22 1977-07-22 Handling method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8739277A JPS5422759A (en) 1977-07-22 1977-07-22 Handling method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5422759A true JPS5422759A (en) 1979-02-20

Family

ID=13913604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8739277A Pending JPS5422759A (en) 1977-07-22 1977-07-22 Handling method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5422759A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5641394U (en) * 1979-09-06 1981-04-16
JP2014107518A (en) * 2012-11-30 2014-06-09 Mitsuboshi Diamond Industrial Co Ltd Scribe tool, scribe method and cutting method of fragile material substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5641394U (en) * 1979-09-06 1981-04-16
JP2014107518A (en) * 2012-11-30 2014-06-09 Mitsuboshi Diamond Industrial Co Ltd Scribe tool, scribe method and cutting method of fragile material substrate

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