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JPS5419384A - Production of semiconductor light emitting devices - Google Patents

Production of semiconductor light emitting devices

Info

Publication number
JPS5419384A
JPS5419384A JP8360477A JP8360477A JPS5419384A JP S5419384 A JPS5419384 A JP S5419384A JP 8360477 A JP8360477 A JP 8360477A JP 8360477 A JP8360477 A JP 8360477A JP S5419384 A JPS5419384 A JP S5419384A
Authority
JP
Japan
Prior art keywords
production
light emitting
semiconductor light
emitting devices
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8360477A
Other languages
Japanese (ja)
Other versions
JPS5646274B2 (en
Inventor
Toshimasa Ishida
Haruo Mori
Tamao Kubota
Kazumasa Ono
Hidemaro Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Original Assignee
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, Oki Electric Industry Co Ltd filed Critical Nippon Telegraph and Telephone Corp
Priority to JP8360477A priority Critical patent/JPS5419384A/en
Publication of JPS5419384A publication Critical patent/JPS5419384A/en
Publication of JPS5646274B2 publication Critical patent/JPS5646274B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Led Devices (AREA)

Abstract

PURPOSE: To produce devices of high luminous power conversion efficiency with the side opposite from electrode face as a light lead-out face by providing grooves which do not cut pn junctions from both sides of substrate and metallizing the entire surface thereafter dividing the substrate to discrete component parts and making electrodes on both sides including the grooves.
COPYRIGHT: (C)1979,JPO&Japio
JP8360477A 1977-07-14 1977-07-14 Production of semiconductor light emitting devices Granted JPS5419384A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8360477A JPS5419384A (en) 1977-07-14 1977-07-14 Production of semiconductor light emitting devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8360477A JPS5419384A (en) 1977-07-14 1977-07-14 Production of semiconductor light emitting devices

Publications (2)

Publication Number Publication Date
JPS5419384A true JPS5419384A (en) 1979-02-14
JPS5646274B2 JPS5646274B2 (en) 1981-10-31

Family

ID=13807075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8360477A Granted JPS5419384A (en) 1977-07-14 1977-07-14 Production of semiconductor light emitting devices

Country Status (1)

Country Link
JP (1) JPS5419384A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966862A (en) * 1989-08-28 1990-10-30 Cree Research, Inc. Method of production of light emitting diodes
US5557149A (en) * 1994-05-11 1996-09-17 Chipscale, Inc. Semiconductor fabrication with contact processing for wrap-around flange interface

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10988572B2 (en) 2017-11-20 2021-04-27 Alliance For Sustainable Energy, Llc Polymers and methods of making the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966862A (en) * 1989-08-28 1990-10-30 Cree Research, Inc. Method of production of light emitting diodes
US5557149A (en) * 1994-05-11 1996-09-17 Chipscale, Inc. Semiconductor fabrication with contact processing for wrap-around flange interface
US5656547A (en) * 1994-05-11 1997-08-12 Chipscale, Inc. Method for making a leadless surface mounted device with wrap-around flange interface contacts

Also Published As

Publication number Publication date
JPS5646274B2 (en) 1981-10-31

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