JPS54162734A - Photopolymerizable resin composition for coating hybrid integrated circuit - Google Patents
Photopolymerizable resin composition for coating hybrid integrated circuitInfo
- Publication number
- JPS54162734A JPS54162734A JP7092978A JP7092978A JPS54162734A JP S54162734 A JPS54162734 A JP S54162734A JP 7092978 A JP7092978 A JP 7092978A JP 7092978 A JP7092978 A JP 7092978A JP S54162734 A JPS54162734 A JP S54162734A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- integrated circuit
- resin composition
- hybrid integrated
- photopolymerizable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 abstract 2
- 238000012644 addition polymerization Methods 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000000178 monomer Substances 0.000 abstract 2
- 239000003504 photosensitizing agent Substances 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 abstract 2
- 239000005062 Polybutadiene Substances 0.000 abstract 1
- 238000009835 boiling Methods 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 abstract 1
- 229920002857 polybutadiene Polymers 0.000 abstract 1
- 239000003505 polymerization initiator Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000012719 thermal polymerization Methods 0.000 abstract 1
Landscapes
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
Abstract
PURPOSE: The title composition capable of giving cured articles having improved electrical properties and heat resistance, comprising a specific organopolysiloxane, polybutadiene or an epoxyacrylate, an addition polymerization monomer, a photosensitizer, a photopolymerization initiator, and a filler.
CONSTITUTION: A pasty composition comprising (A) 100 parts by wt. of an organopolysiloxane, having terminal (meth)acryloyl groups, preferably a molecular weight of 500W10,000, (B) 5W100 parts by wt. of (a) 1,2-polybutadiene or (b) an epoxyacrylate resin (preferably having a molecular weight of 500W5,000) with terminal (meth)acryloyl groups, (C) 5W100 parts by wt. of an addition polymerization monomer having one or more -CH2=C groups and a boiling point ≥100°C under normal pressure, (D) 0.05W5 parts by wt. of a photosensitizer, (E) 0.01W 3 parts by wt. of a thermal polymerization initiator, and (F) 10W200 parts by wt. of a filler having a particle size ≤5μ.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7092978A JPS54162734A (en) | 1978-06-14 | 1978-06-14 | Photopolymerizable resin composition for coating hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7092978A JPS54162734A (en) | 1978-06-14 | 1978-06-14 | Photopolymerizable resin composition for coating hybrid integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54162734A true JPS54162734A (en) | 1979-12-24 |
| JPS6211002B2 JPS6211002B2 (en) | 1987-03-10 |
Family
ID=13445684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7092978A Granted JPS54162734A (en) | 1978-06-14 | 1978-06-14 | Photopolymerizable resin composition for coating hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54162734A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585328A (en) * | 1981-07-02 | 1983-01-12 | Hitachi Chem Co Ltd | Production of unsaturated polyester |
| JPS60215009A (en) * | 1984-01-16 | 1985-10-28 | ロツクタイト コ−ポレ−シヨン | Uv curable silicone rubber composition |
| JPS61270893A (en) * | 1985-05-24 | 1986-12-01 | ニチコン株式会社 | Solder resist |
-
1978
- 1978-06-14 JP JP7092978A patent/JPS54162734A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585328A (en) * | 1981-07-02 | 1983-01-12 | Hitachi Chem Co Ltd | Production of unsaturated polyester |
| JPS60215009A (en) * | 1984-01-16 | 1985-10-28 | ロツクタイト コ−ポレ−シヨン | Uv curable silicone rubber composition |
| JPS61270893A (en) * | 1985-05-24 | 1986-12-01 | ニチコン株式会社 | Solder resist |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211002B2 (en) | 1987-03-10 |
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