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JPS54155132A - Non-cyanogen type silver plating solution - Google Patents

Non-cyanogen type silver plating solution

Info

Publication number
JPS54155132A
JPS54155132A JP6328078A JP6328078A JPS54155132A JP S54155132 A JPS54155132 A JP S54155132A JP 6328078 A JP6328078 A JP 6328078A JP 6328078 A JP6328078 A JP 6328078A JP S54155132 A JPS54155132 A JP S54155132A
Authority
JP
Japan
Prior art keywords
soln
plating
mol
silver plating
scn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6328078A
Other languages
Japanese (ja)
Inventor
Yoshihiro Suzuki
Mitsuru Ura
Hiroshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6328078A priority Critical patent/JPS54155132A/en
Publication of JPS54155132A publication Critical patent/JPS54155132A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To obtain smooth tough plating with low toxicity and improved finishing properties by adding a restricted amt. of triethanolamine as a film reformer to the title plating soln. contg. a specified amt. of SCN- and Ag+.
CONSTITUTION: To a silver plating soln. contg. 0.3W10, pref. 2W5 mol/l of SCN- and 0.04W0.8 mol/l of Ag+ is added 5×(10-3W10-1) mol/l of thriethanolamine as a film reformer. Since this soln. is applicable to high speed electrodeposition at a bath temp. of 35W75°C, thick plating of about 15W30 μm is easily carried out in this soln. to form movable contact point parts of electric power equipment. About 100% current efficiency is attained, and Ag plating speed in this soln. is equal to or higher than that in a CN bath of the same temp.
COPYRIGHT: (C)1979,JPO&Japio
JP6328078A 1978-05-29 1978-05-29 Non-cyanogen type silver plating solution Pending JPS54155132A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6328078A JPS54155132A (en) 1978-05-29 1978-05-29 Non-cyanogen type silver plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6328078A JPS54155132A (en) 1978-05-29 1978-05-29 Non-cyanogen type silver plating solution

Publications (1)

Publication Number Publication Date
JPS54155132A true JPS54155132A (en) 1979-12-06

Family

ID=13224742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6328078A Pending JPS54155132A (en) 1978-05-29 1978-05-29 Non-cyanogen type silver plating solution

Country Status (1)

Country Link
JP (1) JPS54155132A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0705919A1 (en) 1994-10-04 1996-04-10 Electroplating Engineers of Japan Limited Silver plating baths and silver plating method using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0705919A1 (en) 1994-10-04 1996-04-10 Electroplating Engineers of Japan Limited Silver plating baths and silver plating method using the same
US5601696A (en) * 1994-10-04 1997-02-11 Electroplating Engineers Of Japan Limited Silver plating baths and silver plating method using the same

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