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JPS54153583A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54153583A
JPS54153583A JP6161378A JP6161378A JPS54153583A JP S54153583 A JPS54153583 A JP S54153583A JP 6161378 A JP6161378 A JP 6161378A JP 6161378 A JP6161378 A JP 6161378A JP S54153583 A JPS54153583 A JP S54153583A
Authority
JP
Japan
Prior art keywords
film
covered
forming part
photo resist
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6161378A
Other languages
Japanese (ja)
Inventor
Kazumichi Omura
Yoshihisa Mizutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP6161378A priority Critical patent/JPS54153583A/en
Publication of JPS54153583A publication Critical patent/JPS54153583A/en
Pending legal-status Critical Current

Links

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE: To establish the semiconductor device in which the mobility of n channel transistor is increased and the complementary element having the same performance is possible to be manufactured in lesser area.
CONSTITUTION: Taking an example of the inverter manufacture, first, the Si thin film 5 of (111) plane including acceptor is grown on the (0001) plane of the substrate 4 (Fig. a), and the part of form the CMOS inverter element is covered with the CVD SiO2 film 6. Further, the film 5 is etched in island shape (Fig. b). The P channel forming part is covered with the photo resist 7 and B+ ion injection is made to the side surface of the islands of n channel forming part (Fig. c). After removing the photo resist 7, the n channel is covered with the photo resist 8 and P+ ion injection is made to the side surface of the islands of P channel (Fig. d). Further, the film 6 is removed, the gate oxide film 12 is formed with thermal oxidation, P channel forming part is covered with the photo resist 9, and the B+ ions are injected to the n channel forming part (Fig. e). Further, the n channel forming part is covered with the photo resist 10, P+ ions are injected (Fig. f), polycrystal Si film 12 is coated, and the film 12 is removed by leaving only the gate.
COPYRIGHT: (C)1979,JPO&Japio
JP6161378A 1978-05-25 1978-05-25 Semiconductor device Pending JPS54153583A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6161378A JPS54153583A (en) 1978-05-25 1978-05-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6161378A JPS54153583A (en) 1978-05-25 1978-05-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54153583A true JPS54153583A (en) 1979-12-03

Family

ID=13176183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6161378A Pending JPS54153583A (en) 1978-05-25 1978-05-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54153583A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754371A (en) * 1980-09-19 1982-03-31 Toshiba Corp Manufacture of semiconductor device
US5153702A (en) * 1987-06-10 1992-10-06 Hitachi, Ltd. Thin film semiconductor device and method for fabricating the same
US6455875B2 (en) 1992-10-09 2002-09-24 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor having enhanced field mobility
US6624477B1 (en) * 1992-10-09 2003-09-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754371A (en) * 1980-09-19 1982-03-31 Toshiba Corp Manufacture of semiconductor device
US5153702A (en) * 1987-06-10 1992-10-06 Hitachi, Ltd. Thin film semiconductor device and method for fabricating the same
US6455875B2 (en) 1992-10-09 2002-09-24 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor having enhanced field mobility
US6624477B1 (en) * 1992-10-09 2003-09-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US6790749B2 (en) 1992-10-09 2004-09-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US7109108B2 (en) 1992-10-09 2006-09-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device having metal silicide
US7602020B2 (en) 1992-10-09 2009-10-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
US7723788B2 (en) 1992-10-09 2010-05-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same
US8017506B2 (en) 1992-10-09 2011-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for forming the same

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