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JPS54152972A - Transfer molding method for semiconductor device - Google Patents

Transfer molding method for semiconductor device

Info

Publication number
JPS54152972A
JPS54152972A JP6110878A JP6110878A JPS54152972A JP S54152972 A JPS54152972 A JP S54152972A JP 6110878 A JP6110878 A JP 6110878A JP 6110878 A JP6110878 A JP 6110878A JP S54152972 A JPS54152972 A JP S54152972A
Authority
JP
Japan
Prior art keywords
resin
header
resin layer
peel
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6110878A
Other languages
Japanese (ja)
Other versions
JPS6047742B2 (en
Inventor
Hidetoshi Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP53061108A priority Critical patent/JPS6047742B2/en
Publication of JPS54152972A publication Critical patent/JPS54152972A/en
Publication of JPS6047742B2 publication Critical patent/JPS6047742B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To peel off and remove resin flashes together with a resin layer when molded resin hardens and contracts, by positively sticking the peeling-off resin layer to nearly the entire external surface of the header.
CONSTITUTION: Header 14 is mounted on lower mold 10 and lead frame 20 clamped between upper mold 12 and lower mold 10 is arranged inside of cavity 11. To the header-14 mount part of lower mold 10, concave part 10a is made smaller in area than the header and deeper than the airtight contact interval between both the molds. Concave part 10a links to cavity 11 and peeling-off resin layer 26 is formed at the time of molding. In this constitution, molded resin contracts in a hardening process for resin and resin-sealed body 24 and resin layer 26 curves in the opposite directions, so that resin layer 26 will peel off by itself from the reverse surface of header 14. At the same time, resin flashes peel off by themself attending on layer 26, so that there will be no need to remove resin flashes.
COPYRIGHT: (C)1979,JPO&Japio
JP53061108A 1978-05-24 1978-05-24 Transfer molding method for semiconductor devices Expired JPS6047742B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53061108A JPS6047742B2 (en) 1978-05-24 1978-05-24 Transfer molding method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53061108A JPS6047742B2 (en) 1978-05-24 1978-05-24 Transfer molding method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS54152972A true JPS54152972A (en) 1979-12-01
JPS6047742B2 JPS6047742B2 (en) 1985-10-23

Family

ID=13161545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53061108A Expired JPS6047742B2 (en) 1978-05-24 1978-05-24 Transfer molding method for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6047742B2 (en)

Also Published As

Publication number Publication date
JPS6047742B2 (en) 1985-10-23

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