JPS54149646U - - Google Patents
Info
- Publication number
- JPS54149646U JPS54149646U JP4812778U JP4812778U JPS54149646U JP S54149646 U JPS54149646 U JP S54149646U JP 4812778 U JP4812778 U JP 4812778U JP 4812778 U JP4812778 U JP 4812778U JP S54149646 U JPS54149646 U JP S54149646U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Products (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4812778U JPS54149646U (en) | 1978-04-11 | 1978-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4812778U JPS54149646U (en) | 1978-04-11 | 1978-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54149646U true JPS54149646U (en) | 1979-10-18 |
Family
ID=28931256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4812778U Pending JPS54149646U (en) | 1978-04-11 | 1978-04-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54149646U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6077178A (en) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | Ceramic bonded body and manufacture |
JPH08316643A (en) * | 1995-05-18 | 1996-11-29 | Nec Corp | Wiring board |
WO1998026639A1 (en) * | 1995-06-16 | 1998-06-18 | Ibiden Co., Ltd. | Multilayered printed wiring board |
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1978
- 1978-04-11 JP JP4812778U patent/JPS54149646U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6077178A (en) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | Ceramic bonded body and manufacture |
JPH08316643A (en) * | 1995-05-18 | 1996-11-29 | Nec Corp | Wiring board |
WO1998026639A1 (en) * | 1995-06-16 | 1998-06-18 | Ibiden Co., Ltd. | Multilayered printed wiring board |