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JPS54140468A - Glass sealing package type device and its manufacture - Google Patents

Glass sealing package type device and its manufacture

Info

Publication number
JPS54140468A
JPS54140468A JP4777278A JP4777278A JPS54140468A JP S54140468 A JPS54140468 A JP S54140468A JP 4777278 A JP4777278 A JP 4777278A JP 4777278 A JP4777278 A JP 4777278A JP S54140468 A JPS54140468 A JP S54140468A
Authority
JP
Japan
Prior art keywords
lead
pellet
cap
substrate
glass sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4777278A
Other languages
Japanese (ja)
Inventor
Isamu Yamazaki
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4777278A priority Critical patent/JPS54140468A/en
Publication of JPS54140468A publication Critical patent/JPS54140468A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the break of the lead as well as to reduce the limitation of the pellet size by bending the area protruding over the outside of the lead package toward the cap.
CONSTITUTION: The bonded semiconductor pellet 2 is provided on ceramic package substrate 1, and external led 4 is attached at the periphery of pellet 2. Connector line 3 connects the electrode of pellet 2 and lead 4, and ceramic plate 5 cover over substrate 1 as a cap. Then substrate 1 and the projection of lead 4 are supported in a body by holding mold 7 and cope 8. Under these conditions, die 6 is raised up to bent the exposed part of lead 4 upward. After this, the glass sealing is given to connect plate 5 to ceramic plate 1 which is to function as the base via glass layer 9, and lead 4 is bent toward the cap.
COPYRIGHT: (C)1979,JPO&Japio
JP4777278A 1978-04-24 1978-04-24 Glass sealing package type device and its manufacture Pending JPS54140468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4777278A JPS54140468A (en) 1978-04-24 1978-04-24 Glass sealing package type device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4777278A JPS54140468A (en) 1978-04-24 1978-04-24 Glass sealing package type device and its manufacture

Publications (1)

Publication Number Publication Date
JPS54140468A true JPS54140468A (en) 1979-10-31

Family

ID=12784662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4777278A Pending JPS54140468A (en) 1978-04-24 1978-04-24 Glass sealing package type device and its manufacture

Country Status (1)

Country Link
JP (1) JPS54140468A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138350U (en) * 1982-03-10 1983-09-17 日本電気ホームエレクトロニクス株式会社 lead frame
US4677741A (en) * 1981-11-30 1987-07-07 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing package for high power integrated circuit
US4699675A (en) * 1985-12-26 1987-10-13 Rca Corporation Vapor phase growth of III-V materials
US4994896A (en) * 1987-05-27 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198965A (en) * 1975-02-26 1976-08-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198965A (en) * 1975-02-26 1976-08-31

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677741A (en) * 1981-11-30 1987-07-07 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing package for high power integrated circuit
JPS58138350U (en) * 1982-03-10 1983-09-17 日本電気ホームエレクトロニクス株式会社 lead frame
US4699675A (en) * 1985-12-26 1987-10-13 Rca Corporation Vapor phase growth of III-V materials
US4994896A (en) * 1987-05-27 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

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