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JPS54124968A - Manufacture of semiconductor element - Google Patents

Manufacture of semiconductor element

Info

Publication number
JPS54124968A
JPS54124968A JP3236078A JP3236078A JPS54124968A JP S54124968 A JPS54124968 A JP S54124968A JP 3236078 A JP3236078 A JP 3236078A JP 3236078 A JP3236078 A JP 3236078A JP S54124968 A JPS54124968 A JP S54124968A
Authority
JP
Japan
Prior art keywords
sheet
substrate
heating
temperature
adhesive strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3236078A
Other languages
Japanese (ja)
Inventor
Tsutomu Nagatomi
Tsuneo Kida
Sadatake Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP3236078A priority Critical patent/JPS54124968A/en
Publication of JPS54124968A publication Critical patent/JPS54124968A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To evade the breakaway and falling off of an element in a process by making a semiconductor substrate in contact with an adhesive sheet whose adhesive strength varies with heating temperature, by scribing the substrate after pressurewelding by heating by a heating element to a fixed temperature, and by dividing the substrate into respective elements by partial pressing.
CONSTITUTION: Semiconductor substrate 3 is mounted on base mount 1 via sheet 2 for protecting the surface of a semiconductor element, and the entire surface is covered with ashesive sheet 4 with expansibility. In this case, sheet 4 uses a substance whose adhesive strength varies with heating temperature. Next, heating roller 15a provided internally with electric heater 15c with rotation support axes 15b and 15b' as lead-out electrodes is mounted on sheet 4, and sheet 4 is pressure- welded to substrate 3 while roller 15a is controlled by temperature controller 6 externally arranged to a fixed temperature. Then, substrate 3 is scribed and divided into individual elements by partial pressing.
COPYRIGHT: (C)1979,JPO&Japio
JP3236078A 1978-03-23 1978-03-23 Manufacture of semiconductor element Pending JPS54124968A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3236078A JPS54124968A (en) 1978-03-23 1978-03-23 Manufacture of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3236078A JPS54124968A (en) 1978-03-23 1978-03-23 Manufacture of semiconductor element

Publications (1)

Publication Number Publication Date
JPS54124968A true JPS54124968A (en) 1979-09-28

Family

ID=12356780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3236078A Pending JPS54124968A (en) 1978-03-23 1978-03-23 Manufacture of semiconductor element

Country Status (1)

Country Link
JP (1) JPS54124968A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520246U (en) * 1978-07-24 1980-02-08
US7563343B2 (en) * 2002-11-29 2009-07-21 Fujitsu Microelectronics Limited Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520246U (en) * 1978-07-24 1980-02-08
US7563343B2 (en) * 2002-11-29 2009-07-21 Fujitsu Microelectronics Limited Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus

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