JPS54117690A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS54117690A JPS54117690A JP2480278A JP2480278A JPS54117690A JP S54117690 A JPS54117690 A JP S54117690A JP 2480278 A JP2480278 A JP 2480278A JP 2480278 A JP2480278 A JP 2480278A JP S54117690 A JPS54117690 A JP S54117690A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- type
- sio
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE: To make a pattern minute to enhance dielectric strength and reduce a floating capacity and a gate resistance to make a device suitable for high frequency by causing an oxide film to self-align in diffusion and metal etching processes.
CONSTITUTION: N--type layer 2 is grown epitaxially on N+-type Si substrate 1 to be a drain region, and SiO2 film 31 is provided only on a gate forming region. Next, a Si layer is grown epitaxially again on all the surface, and single crystal Si layer 21 and poly-crystal Si layer 22 are formed on exposed substrate 1 and film 21 respectively. After that, the pattern of photo resistor film 8 is provided, and the boundary between layers 21 and 22 is converted to porous Si layer 7 reaching layer 2 by electrification in fluoric acid solution, and layer 7 is subjected to heat treatment in wet oxygen and is made of SiO2 layer 3. Next, a window is provided in SiO2 film 33 on layer 21 generated at this time, and P+-type gate region 4 and N+-type source region 5 are formed in layers 2 and 21 respectively through layer 22 by diffusion. After that, metal is caused to adhere to the surface and is etched selectively, and electrode wirings are provided on these regions.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2480278A JPS54117690A (en) | 1978-03-03 | 1978-03-03 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2480278A JPS54117690A (en) | 1978-03-03 | 1978-03-03 | Production of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54117690A true JPS54117690A (en) | 1979-09-12 |
JPS6125226B2 JPS6125226B2 (en) | 1986-06-14 |
Family
ID=12148317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2480278A Granted JPS54117690A (en) | 1978-03-03 | 1978-03-03 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54117690A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56157058A (en) * | 1980-04-14 | 1981-12-04 | Thomson Csf | Semiconductor device and method of manufacturing same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63190905A (en) * | 1987-01-31 | 1988-08-08 | Hiroshi Sato | Parallel driving type hydraulic motor device and vehicle driven by hydraulic motor |
JPS63172725U (en) * | 1987-04-30 | 1988-11-09 |
-
1978
- 1978-03-03 JP JP2480278A patent/JPS54117690A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56157058A (en) * | 1980-04-14 | 1981-12-04 | Thomson Csf | Semiconductor device and method of manufacturing same |
JPH0126183B2 (en) * | 1980-04-14 | 1989-05-22 | Thomson Csf |
Also Published As
Publication number | Publication date |
---|---|
JPS6125226B2 (en) | 1986-06-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5516464A (en) | Method of forming wafer for semiconductor device | |
JPS54108582A (en) | Manufacture of silicon type field effect transistor | |
JPS54117690A (en) | Production of semiconductor device | |
JPS5772333A (en) | Manufacture of semiconductor device | |
JPS54130883A (en) | Production of semiconductor device | |
JPS5575238A (en) | Method of fabricating semiconductor device | |
JPS55157241A (en) | Manufacture of semiconductor device | |
JPS5583267A (en) | Method of fabricating semiconductor device | |
JPS56111264A (en) | Manufacture of semiconductor device | |
JPS56137648A (en) | Manufacture of semiconductor device | |
JPS54139486A (en) | Manufacture of semiconductor device | |
JPS5748248A (en) | Manufacture of semiconductor device | |
JPS55108772A (en) | Semiconductor integrated circuit device | |
JPS5513953A (en) | Complementary integrated circuit | |
JPS57114274A (en) | Electrode for semiconductor device and manufacture thereof | |
JPS57121231A (en) | Manufacture of semiconductor device | |
JPS5718362A (en) | Semiconductor device and manufacture thereof | |
JPS5637679A (en) | Manufacture of semiconductor device | |
JPS57193062A (en) | Manufacture of semiconductor device | |
JPS5610945A (en) | Manufacture of semiconductor device | |
JPS55153370A (en) | Manufacturing method of semiconductor device | |
JPS54156492A (en) | Manufacture for integrated circuit device | |
JPS5596680A (en) | Method of fabricating mos semiconductor device | |
JPS56146281A (en) | Manufacture of semiconductor integrated circuit | |
JPS6425481A (en) | Manufacture of semiconductor device |