JPS5367800A - Preparation of resin for laminated sheet - Google Patents
Preparation of resin for laminated sheetInfo
- Publication number
- JPS5367800A JPS5367800A JP14321076A JP14321076A JPS5367800A JP S5367800 A JPS5367800 A JP S5367800A JP 14321076 A JP14321076 A JP 14321076A JP 14321076 A JP14321076 A JP 14321076A JP S5367800 A JPS5367800 A JP S5367800A
- Authority
- JP
- Japan
- Prior art keywords
- laminated sheet
- resin
- preparation
- eqoxy
- dicyandimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 abstract 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To prepare an eqoxy resin composition for laminated sheet freed from generation of brown spots by incorporating an epoxy resin with N,N'-dimethylformamide to enhance dispersibility of dicyandimide (curing agent).
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14321076A JPS5367800A (en) | 1976-11-29 | 1976-11-29 | Preparation of resin for laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14321076A JPS5367800A (en) | 1976-11-29 | 1976-11-29 | Preparation of resin for laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5367800A true JPS5367800A (en) | 1978-06-16 |
Family
ID=15333438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14321076A Pending JPS5367800A (en) | 1976-11-29 | 1976-11-29 | Preparation of resin for laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5367800A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3332553A1 (en) * | 1983-09-09 | 1985-04-04 | Skw Trostberg Ag, 8223 Trostberg | HARDENER SOLUTION FOR EPOXY RESINS |
EP0223061A2 (en) * | 1985-10-23 | 1987-05-27 | International Business Machines Corporation | Process for the production of prepreg sheets |
-
1976
- 1976-11-29 JP JP14321076A patent/JPS5367800A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3332553A1 (en) * | 1983-09-09 | 1985-04-04 | Skw Trostberg Ag, 8223 Trostberg | HARDENER SOLUTION FOR EPOXY RESINS |
DE3332553C2 (en) * | 1983-09-09 | 1987-01-15 | Skw Trostberg Ag, 8223 Trostberg | Hardener solution for epoxy resins |
EP0223061A2 (en) * | 1985-10-23 | 1987-05-27 | International Business Machines Corporation | Process for the production of prepreg sheets |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS52125600A (en) | Curing catalysts for epoxy resins | |
JPS5367800A (en) | Preparation of resin for laminated sheet | |
JPS5254798A (en) | Thermosetting resin compositions | |
JPS5260843A (en) | Resin compositions with improved flowability | |
JPS51135999A (en) | Epoxy res in composition | |
JPS5378299A (en) | Epoxy resin composition | |
JPS5216534A (en) | Powder coating resin composition | |
JPS524600A (en) | Curing of epoxy resin | |
JPS5231615A (en) | Contour compensation circuit | |
JPS5340098A (en) | Heat resistant resin composition | |
JPS5382899A (en) | Heat resistant resin composition | |
JPS5359797A (en) | Metal-containing curable composition having ionic bond | |
JPS5317698A (en) | Preparation of epoxy resin varnishes | |
JPS51143098A (en) | Preparation of unsaturated resin | |
JPS5411500A (en) | Insulating resin composite | |
JPS5322589A (en) | Hardening resin composition | |
JPS542667A (en) | Manufacture of semiconductor device | |
JPS5437200A (en) | Epoxy resin composition | |
JPS53127540A (en) | Adhesive composition | |
JPS5225854A (en) | Epoxy resin composition | |
JPS5235241A (en) | Thixotrotic composition of urethane modified acrylate resin | |
JPS52151397A (en) | Preparation of resin for laminate | |
JPS5365357A (en) | Photocurable organo polysiloxane composition | |
JPS53124544A (en) | Adhesive composition having improved temperature stability | |
JPS5357477A (en) | Self-fusing cable |