JPS536756B2 - - Google Patents
Info
- Publication number
- JPS536756B2 JPS536756B2 JP5229674A JP5229674A JPS536756B2 JP S536756 B2 JPS536756 B2 JP S536756B2 JP 5229674 A JP5229674 A JP 5229674A JP 5229674 A JP5229674 A JP 5229674A JP S536756 B2 JPS536756 B2 JP S536756B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5229674A JPS536756B2 (en) | 1974-05-13 | 1974-05-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5229674A JPS536756B2 (en) | 1974-05-13 | 1974-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50144987A JPS50144987A (en) | 1975-11-21 |
| JPS536756B2 true JPS536756B2 (en) | 1978-03-10 |
Family
ID=12910825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5229674A Expired JPS536756B2 (en) | 1974-05-13 | 1974-05-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS536756B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002150548A (en) * | 2000-11-09 | 2002-05-24 | Hoya Corp | Method of manufacturing glass substrate for information recording medium and method of manufacturing information recording medium |
| JP2005103684A (en) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | Colloidal dispersion type lapping compound and its manufacturing method |
| JP2005105068A (en) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | Lapping slurry and method for processing wafer |
| JP2007036271A (en) * | 1996-09-30 | 2007-02-08 | Hitachi Chem Co Ltd | Cerium oxide abrasive, and method of polishing substrate |
| CN108949036A (en) * | 2018-09-06 | 2018-12-07 | 北京保利世达科技有限公司 | A kind of polishing fluid and the polishing method to carborundum crystals |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5281692A (en) * | 1975-12-28 | 1977-07-08 | Fujimi Kenmazai Kougiyou Kk | Method of grinding general metallic materials and composites for grinding |
| DE2722780A1 (en) * | 1977-05-20 | 1978-11-23 | Wacker Chemitronic | LAEP RELEASE AGENT |
-
1974
- 1974-05-13 JP JP5229674A patent/JPS536756B2/ja not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036271A (en) * | 1996-09-30 | 2007-02-08 | Hitachi Chem Co Ltd | Cerium oxide abrasive, and method of polishing substrate |
| JP2007036270A (en) * | 1996-09-30 | 2007-02-08 | Hitachi Chem Co Ltd | Cerium oxide abrasive, and method of polishing substrate |
| JP2002150548A (en) * | 2000-11-09 | 2002-05-24 | Hoya Corp | Method of manufacturing glass substrate for information recording medium and method of manufacturing information recording medium |
| JP4562274B2 (en) * | 2000-11-09 | 2010-10-13 | Ｈｏｙａ株式会社 | Manufacturing method of glass substrate for information recording medium and manufacturing method of information recording medium |
| JP2005103684A (en) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | Colloidal dispersion type lapping compound and its manufacturing method |
| JP2005105068A (en) * | 2003-09-29 | 2005-04-21 | Mimasu Semiconductor Industry Co Ltd | Lapping slurry and method for processing wafer |
| CN108949036A (en) * | 2018-09-06 | 2018-12-07 | 北京保利世达科技有限公司 | A kind of polishing fluid and the polishing method to carborundum crystals |
| CN108949036B (en) * | 2018-09-06 | 2021-01-05 | 北京保利世达科技有限公司 | Polishing solution and method for polishing silicon carbide crystals |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50144987A (en) | 1975-11-21 |