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JPS5355966A - Mechanism for catching lead frames - Google Patents

Mechanism for catching lead frames

Info

Publication number
JPS5355966A
JPS5355966A JP13105976A JP13105976A JPS5355966A JP S5355966 A JPS5355966 A JP S5355966A JP 13105976 A JP13105976 A JP 13105976A JP 13105976 A JP13105976 A JP 13105976A JP S5355966 A JPS5355966 A JP S5355966A
Authority
JP
Japan
Prior art keywords
lead frames
catching
catching lead
frames
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13105976A
Other languages
Japanese (ja)
Inventor
Tooru Takamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP13105976A priority Critical patent/JPS5355966A/en
Publication of JPS5355966A publication Critical patent/JPS5355966A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP13105976A 1976-10-30 1976-10-30 Mechanism for catching lead frames Pending JPS5355966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13105976A JPS5355966A (en) 1976-10-30 1976-10-30 Mechanism for catching lead frames

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13105976A JPS5355966A (en) 1976-10-30 1976-10-30 Mechanism for catching lead frames

Publications (1)

Publication Number Publication Date
JPS5355966A true JPS5355966A (en) 1978-05-20

Family

ID=15049034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13105976A Pending JPS5355966A (en) 1976-10-30 1976-10-30 Mechanism for catching lead frames

Country Status (1)

Country Link
JP (1) JPS5355966A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111767A (en) * 1978-02-21 1979-09-01 Nec Corp Manufacture for semiconductor device
JPS62291039A (en) * 1986-06-10 1987-12-17 Shinkawa Ltd Bonding device
DE102016217215A1 (en) 2015-11-04 2017-05-04 Toyota Jidosha Kabushiki Kaisha battery device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051261A (en) * 1973-09-07 1975-05-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051261A (en) * 1973-09-07 1975-05-08

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111767A (en) * 1978-02-21 1979-09-01 Nec Corp Manufacture for semiconductor device
JPS6142857B2 (en) * 1978-02-21 1986-09-24 Nippon Electric Co
JPS62291039A (en) * 1986-06-10 1987-12-17 Shinkawa Ltd Bonding device
JPH051980B2 (en) * 1986-06-10 1993-01-11 Shinkawa Kk
DE102016217215A1 (en) 2015-11-04 2017-05-04 Toyota Jidosha Kabushiki Kaisha battery device

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