JPS5351256A - Mold for forming resin - Google Patents
Mold for forming resinInfo
- Publication number
- JPS5351256A JPS5351256A JP12607376A JP12607376A JPS5351256A JP S5351256 A JPS5351256 A JP S5351256A JP 12607376 A JP12607376 A JP 12607376A JP 12607376 A JP12607376 A JP 12607376A JP S5351256 A JPS5351256 A JP S5351256A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- forming resin
- resin
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12607376A JPS5351256A (en) | 1976-10-22 | 1976-10-22 | Mold for forming resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12607376A JPS5351256A (en) | 1976-10-22 | 1976-10-22 | Mold for forming resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5351256A true JPS5351256A (en) | 1978-05-10 |
JPS6236851B2 JPS6236851B2 (en) | 1987-08-10 |
Family
ID=14925936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12607376A Granted JPS5351256A (en) | 1976-10-22 | 1976-10-22 | Mold for forming resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5351256A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55140541A (en) * | 1979-04-23 | 1980-11-04 | Hitachi Ltd | Forming mold |
JPS60121729A (en) * | 1983-12-05 | 1985-06-29 | Toshiba Corp | Semiconductor resin-sealing metal mold |
JPH0582574A (en) * | 1991-09-24 | 1993-04-02 | Mitsui High Tec Inc | Manufacture of ultra-thin type semiconductor device |
JPH05169483A (en) * | 1991-12-25 | 1993-07-09 | Mitsui High Tec Inc | Resin seal mold for semiconductor device |
-
1976
- 1976-10-22 JP JP12607376A patent/JPS5351256A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55140541A (en) * | 1979-04-23 | 1980-11-04 | Hitachi Ltd | Forming mold |
JPS60121729A (en) * | 1983-12-05 | 1985-06-29 | Toshiba Corp | Semiconductor resin-sealing metal mold |
JPH0582574A (en) * | 1991-09-24 | 1993-04-02 | Mitsui High Tec Inc | Manufacture of ultra-thin type semiconductor device |
JPH05169483A (en) * | 1991-12-25 | 1993-07-09 | Mitsui High Tec Inc | Resin seal mold for semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6236851B2 (en) | 1987-08-10 |
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