JPS5341069B2 - - Google Patents

Info

Publication number: JPS5341069B2
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP11052774A

Other languages

Other versions

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-09-27

Filing date

1974-09-27

Publication date

1978-10-31

1974-09-27 Application filed filed Critical

1974-09-27 Priority to JP11052774A priority Critical patent/JPS5341069B2/ja

1976-03-29 Publication of JPS5137571A publication Critical patent/JPS5137571A/ja

1978-10-31 Publication of JPS5341069B2 publication Critical patent/JPS5341069B2/ja

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

Led Device Packages (AREA)

JP11052774A 1974-09-27 1974-09-27 Expired JPS5341069B2 (zh)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP11052774A JPS5341069B2 (zh)	1974-09-27	1974-09-27

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP11052774A JPS5341069B2 (zh)	1974-09-27	1974-09-27

Publications (2)

Publication Number	Publication Date
JPS5137571A JPS5137571A (zh)	1976-03-29
JPS5341069B2 true JPS5341069B2 (zh)	1978-10-31

Family

ID=14538053

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP11052774A Expired JPS5341069B2 (zh)	1974-09-27	1974-09-27

Country Status (1)

Country	Link
JP (1)	JPS5341069B2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3782411B2 (ja) *	2002-09-02	2006-06-07	松下電器産業株式会社	発光装置
US7078737B2 (en)	2002-09-02	2006-07-18	Matsushita Electric Industrial Co., Ltd.	Light-emitting device

1974
- 1974-09-27 JP JP11052774A patent/JPS5341069B2/ja not_active Expired

Also Published As

Publication number	Publication date
JPS5137571A (zh)	1976-03-29

Publication	Publication Date	Title
AU477223B2 (zh)	1976-10-21
JPS5137571A (zh)	1976-03-29
AU479230B2 (zh)	1974-10-10
FI752982A7 (zh)	1976-05-03
CS170440B1 (zh)	1976-08-27
CS167463B1 (zh)	1976-04-29
AR198461Q (zh)	1974-06-21
FR2262973A1 (zh)	1975-10-03
AU6599774A (zh)	1975-08-28
BG19650A1 (zh)	1975-10-10
BG19856A1 (zh)	1975-10-30
CH588317A5 (zh)	1977-05-31
CH562379A5 (zh)	1975-05-30
AU479931A (zh)	1976-06-10
AU479987A (zh)	1976-02-05
AU480465A (zh)	1976-02-19
AU480783A (zh)	1976-06-24
AU480922A (zh)	1977-02-15
AU481045A (zh)	1975-11-13
AU481219A (zh)	1975-11-06
AU482022A (zh)	1976-05-20
DD110111A1 (zh)	1974-12-05
AU7504272A (zh)	1975-02-13
BG19614A1 (zh)	1975-10-10
BG19759A1 (zh)	1975-10-10