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JPS5333064A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5333064A
JPS5333064A JP10674376A JP10674376A JPS5333064A JP S5333064 A JPS5333064 A JP S5333064A JP 10674376 A JP10674376 A JP 10674376A JP 10674376 A JP10674376 A JP 10674376A JP S5333064 A JPS5333064 A JP S5333064A
Authority
JP
Japan
Prior art keywords
leads
pellet
semiconductor device
insulation plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10674376A
Other languages
Japanese (ja)
Other versions
JPS5645300B2 (en
Inventor
Tadaaki Kariya
Masami Fujii
Akira Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10674376A priority Critical patent/JPS5333064A/en
Publication of JPS5333064A publication Critical patent/JPS5333064A/en
Publication of JPS5645300B2 publication Critical patent/JPS5645300B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent the external force and thermal stress on leads from being directly applied to a pellet by once bonding two leads to an insulation plate then leading them to the outside in mounting the silicon pellet having leads on both sides onto a heat radiating plate through the insulation plate and sealing the pellet with resin.
COPYRIGHT: (C)1978,JPO&Japio
JP10674376A 1976-09-08 1976-09-08 Semiconductor device Granted JPS5333064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10674376A JPS5333064A (en) 1976-09-08 1976-09-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10674376A JPS5333064A (en) 1976-09-08 1976-09-08 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5333064A true JPS5333064A (en) 1978-03-28
JPS5645300B2 JPS5645300B2 (en) 1981-10-26

Family

ID=14441392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10674376A Granted JPS5333064A (en) 1976-09-08 1976-09-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5333064A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119665U (en) * 1980-02-13 1981-09-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119665U (en) * 1980-02-13 1981-09-11

Also Published As

Publication number Publication date
JPS5645300B2 (en) 1981-10-26

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