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JPS5331969A - Airtight sealing method of semiconductor device - Google Patents

Airtight sealing method of semiconductor device

Info

Publication number
JPS5331969A
JPS5331969A JP10584976A JP10584976A JPS5331969A JP S5331969 A JPS5331969 A JP S5331969A JP 10584976 A JP10584976 A JP 10584976A JP 10584976 A JP10584976 A JP 10584976A JP S5331969 A JPS5331969 A JP S5331969A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing method
airtight sealing
placing
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10584976A
Other languages
Japanese (ja)
Inventor
Akira Demura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10584976A priority Critical patent/JPS5331969A/en
Publication of JPS5331969A publication Critical patent/JPS5331969A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To perform sealing by placing a metal foil which readily alloys with low melting point metal foils between the low melting point metal foils over a seal ring, placing a cap thereon and making eutectic alloy through heat treatmemt.
COPYRIGHT: (C)1978,JPO&Japio
JP10584976A 1976-09-06 1976-09-06 Airtight sealing method of semiconductor device Pending JPS5331969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10584976A JPS5331969A (en) 1976-09-06 1976-09-06 Airtight sealing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10584976A JPS5331969A (en) 1976-09-06 1976-09-06 Airtight sealing method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5331969A true JPS5331969A (en) 1978-03-25

Family

ID=14418444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10584976A Pending JPS5331969A (en) 1976-09-06 1976-09-06 Airtight sealing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5331969A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079745U (en) * 1983-11-04 1985-06-03 住友金属鉱山株式会社 Hermetic seal cover
JPS6167941A (en) * 1984-09-11 1986-04-08 Fujitsu Ltd Sealing method for hybrid integrated circuits
JPS63104355A (en) * 1986-10-21 1988-05-09 Kyocera Corp Seal ring for IC ceramic package and its manufacturing method
JP2004202581A (en) * 2002-12-24 2004-07-22 Agilent Technol Inc System and method for forming hermetic seal

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50149274A (en) * 1974-05-20 1975-11-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50149274A (en) * 1974-05-20 1975-11-29

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079745U (en) * 1983-11-04 1985-06-03 住友金属鉱山株式会社 Hermetic seal cover
JPS6167941A (en) * 1984-09-11 1986-04-08 Fujitsu Ltd Sealing method for hybrid integrated circuits
JPS63104355A (en) * 1986-10-21 1988-05-09 Kyocera Corp Seal ring for IC ceramic package and its manufacturing method
JP2004202581A (en) * 2002-12-24 2004-07-22 Agilent Technol Inc System and method for forming hermetic seal

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