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JPS5330592B2 - - Google Patents

Info

Publication number
JPS5330592B2
JPS5330592B2 JP4779074A JP4779074A JPS5330592B2 JP S5330592 B2 JPS5330592 B2 JP S5330592B2 JP 4779074 A JP4779074 A JP 4779074A JP 4779074 A JP4779074 A JP 4779074A JP S5330592 B2 JPS5330592 B2 JP S5330592B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4779074A
Other versions
JPS5016485A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5016485A publication Critical patent/JPS5016485A/ja
Publication of JPS5330592B2 publication Critical patent/JPS5330592B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
JP4779074A 1973-04-30 1974-04-30 Expired JPS5330592B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US356010A US3861023A (en) 1973-04-30 1973-04-30 Fully repairable integrated circuit interconnections

Publications (2)

Publication Number Publication Date
JPS5016485A JPS5016485A (ja) 1975-02-21
JPS5330592B2 true JPS5330592B2 (ja) 1978-08-28

Family

ID=23399720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4779074A Expired JPS5330592B2 (ja) 1973-04-30 1974-04-30

Country Status (8)

Country Link
US (1) US3861023A (ja)
JP (1) JPS5330592B2 (ja)
BE (1) BE814300A (ja)
DE (1) DE2418906B2 (ja)
FR (1) FR2227637B1 (ja)
GB (1) GB1444193A (ja)
IT (1) IT1004290B (ja)
NL (1) NL160986C (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51148389A (en) * 1975-06-14 1976-12-20 Fujitsu Ltd Manufacturing method of semiconductor device
US3969670A (en) * 1975-06-30 1976-07-13 International Business Machines Corporation Electron beam testing of integrated circuits
JPS54139415A (en) * 1978-04-21 1979-10-29 Hitachi Ltd Semiconductor channel switch
FR2426334A1 (fr) * 1978-05-19 1979-12-14 Fujitsu Ltd Dispositif de connexion de semi-conducteurs et son procede de fabrication
US4259367A (en) * 1979-07-30 1981-03-31 International Business Machines Corporation Fine line repair technique
JPS58105112U (ja) * 1982-01-11 1983-07-18 東北金属工業株式会社 インダクタ
FR2554622B1 (fr) * 1983-11-03 1988-01-15 Commissariat Energie Atomique Procede de fabrication d'une matrice de composants electroniques
US4703436A (en) * 1984-02-01 1987-10-27 Inova Microelectronics Corporation Wafer level integration technique
JPS6151715U (ja) * 1984-09-07 1986-04-07
JPS62201574U (ja) * 1986-06-13 1987-12-22
US4725773A (en) * 1986-06-27 1988-02-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Cross-contact chain
JP2521846Y2 (ja) * 1987-07-06 1997-01-08 三井石油化学工業株式会社 トロイダルコイル
EP0650196A2 (en) * 1988-04-22 1995-04-26 Fujitsu Limited Semiconductor integrated circuit device and method of producing the same using master slice approach
US4829014A (en) * 1988-05-02 1989-05-09 General Electric Company Screenable power chip mosaics, a method for fabricating large power semiconductor chips
JPH0235411U (ja) * 1988-08-29 1990-03-07
US4974048A (en) * 1989-03-10 1990-11-27 The Boeing Company Integrated circuit having reroutable conductive paths
GB9222840D0 (en) * 1992-10-31 1992-12-16 Smiths Industries Plc Electronic assemblies
US6222212B1 (en) 1994-01-27 2001-04-24 Integrated Device Technology, Inc. Semiconductor device having programmable interconnect layers
US5514613A (en) * 1994-01-27 1996-05-07 Integrated Device Technology Parallel manufacturing of semiconductor devices and the resulting structure
TW369712B (en) * 1994-10-14 1999-09-11 Ibm Structure and method for connecting to integrated circuitry
US7179661B1 (en) * 1999-12-14 2007-02-20 Kla-Tencor Chemical mechanical polishing test structures and methods for inspecting the same
US7655482B2 (en) * 2000-04-18 2010-02-02 Kla-Tencor Chemical mechanical polishing test structures and methods for inspecting the same
JP6226059B2 (ja) * 2014-03-04 2017-11-08 株式会社村田製作所 コイル部品およびコイルモジュール、並びに、コイル部品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312871A (en) * 1964-12-23 1967-04-04 Ibm Interconnection arrangement for integrated circuits
US3436611A (en) * 1965-01-25 1969-04-01 Texas Instruments Inc Insulation structure for crossover leads in integrated circuitry
US3377513A (en) * 1966-05-02 1968-04-09 North American Rockwell Integrated circuit diode matrix
US3365707A (en) * 1967-06-23 1968-01-23 Rca Corp Lsi array and standard cells
US3641661A (en) * 1968-06-25 1972-02-15 Texas Instruments Inc Method of fabricating integrated circuit arrays
GB1306189A (ja) * 1968-09-25 1973-02-07
US3771217A (en) * 1971-04-16 1973-11-13 Texas Instruments Inc Integrated circuit arrays utilizing discretionary wiring and method of fabricating same
JPS493035A (ja) * 1972-05-01 1974-01-11

Also Published As

Publication number Publication date
FR2227637A1 (ja) 1974-11-22
JPS5016485A (ja) 1975-02-21
FR2227637B1 (ja) 1978-01-20
DE2418906A1 (de) 1974-12-12
IT1004290B (it) 1976-07-10
DE2418906C3 (ja) 1985-01-31
GB1444193A (en) 1976-07-28
NL7405791A (ja) 1974-11-01
DE2418906B2 (de) 1979-12-20
NL160986B (nl) 1979-07-16
US3861023A (en) 1975-01-21
NL160986C (nl) 1979-12-17
BE814300A (fr) 1974-08-16

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