[go: up one dir, main page]

JPS5318962A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS5318962A
JPS5318962A JP9385976A JP9385976A JPS5318962A JP S5318962 A JPS5318962 A JP S5318962A JP 9385976 A JP9385976 A JP 9385976A JP 9385976 A JP9385976 A JP 9385976A JP S5318962 A JPS5318962 A JP S5318962A
Authority
JP
Japan
Prior art keywords
semiconductor package
substrate
metallized
brazing
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9385976A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9385976A priority Critical patent/JPS5318962A/en
Publication of JPS5318962A publication Critical patent/JPS5318962A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To lower the electric resistance of metallized layers by leading out one of metallized patterns to the back of an insulation substrate through a through-hole and brazing said pattern to the external lead extended up to there on the back of the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP9385976A 1976-08-05 1976-08-05 Semiconductor package Pending JPS5318962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9385976A JPS5318962A (en) 1976-08-05 1976-08-05 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9385976A JPS5318962A (en) 1976-08-05 1976-08-05 Semiconductor package

Publications (1)

Publication Number Publication Date
JPS5318962A true JPS5318962A (en) 1978-02-21

Family

ID=14094150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9385976A Pending JPS5318962A (en) 1976-08-05 1976-08-05 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS5318962A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822741U (en) * 1981-08-07 1983-02-12 京セラ株式会社 semiconductor package
JPS5881951U (en) * 1981-11-27 1983-06-03 日本特殊陶業株式会社 Package for mounting semiconductor elements
JPH0312953A (en) * 1989-06-12 1991-01-21 Nec Corp Semiconductor container

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5822741U (en) * 1981-08-07 1983-02-12 京セラ株式会社 semiconductor package
JPS635238Y2 (en) * 1981-08-07 1988-02-12
JPS5881951U (en) * 1981-11-27 1983-06-03 日本特殊陶業株式会社 Package for mounting semiconductor elements
JPH0312953A (en) * 1989-06-12 1991-01-21 Nec Corp Semiconductor container

Similar Documents

Publication Publication Date Title
JPS5350686A (en) Production of semiconductor integrated circuit
JPS5394881A (en) Integrated circuit device
JPS5318962A (en) Semiconductor package
JPS548976A (en) Lsi package
JPS534472A (en) Semiconductor package
JPS5378789A (en) Manufacture of semiconductor integrated circuit
JPS52143785A (en) Semiconductor device
JPS5326689A (en) Semiconductor integrated circuit unit
JPS52156559A (en) Small electronic device packaging package
JPS52149973A (en) External lead of electronic parts
JPS5380183A (en) Semiconductor device
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS5313874A (en) Production of semiconductor device
JPS5268388A (en) Semiconductor integrated circuit
JPS534471A (en) Semiconductor package
JPS5269283A (en) Erosion-proof wiring
JPS535571A (en) Circuit block and its manufacture
JPS5368970A (en) Solder electrode structure
JPS551604A (en) Magnetic bubble memory device
JPS5435690A (en) Manufacture of semiconductor device of multilayer wiring type
JPS5368163A (en) Production of flip chip
JPS53108372A (en) Substrate for wireless bonding
JPS5349948A (en) Semiconductor device
JPS5367386A (en) Semiconductor device
JPS5352388A (en) Semiconductor device