[go: up one dir, main page]

JPS5315784A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5315784A
JPS5315784A JP9064776A JP9064776A JPS5315784A JP S5315784 A JPS5315784 A JP S5315784A JP 9064776 A JP9064776 A JP 9064776A JP 9064776 A JP9064776 A JP 9064776A JP S5315784 A JPS5315784 A JP S5315784A
Authority
JP
Japan
Prior art keywords
semiconductor device
packages
ceramics
disposing
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9064776A
Other languages
Japanese (ja)
Inventor
Mikio Nishihata
Takeshi Suzuki
Hironobu Hatakeyama
Shigeru Mitsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9064776A priority Critical patent/JPS5315784A/en
Publication of JPS5315784A publication Critical patent/JPS5315784A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the packaging cost of diodes and improve their reliability by forming the circumferential edge of a plated heat sink formed under each element to a depression type and disposing the element to the bottom part thereof and sealing the circumference with resin without using packages with ceramics.
COPYRIGHT: (C)1978,JPO&Japio
JP9064776A 1976-07-28 1976-07-28 Semiconductor device Pending JPS5315784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9064776A JPS5315784A (en) 1976-07-28 1976-07-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9064776A JPS5315784A (en) 1976-07-28 1976-07-28 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5315784A true JPS5315784A (en) 1978-02-14

Family

ID=14004291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9064776A Pending JPS5315784A (en) 1976-07-28 1976-07-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5315784A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990946A (en) * 1982-10-18 1984-05-25 レイセオン　カンパニ− Method of producing semiconductor structure
JPS61258464A (en) * 1985-01-31 1986-11-15 テキサス　インスツルメンツ　インコ−ポレイテツド microwave equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990946A (en) * 1982-10-18 1984-05-25 レイセオン　カンパニ− Method of producing semiconductor structure
JPS61258464A (en) * 1985-01-31 1986-11-15 テキサス　インスツルメンツ　インコ−ポレイテツド microwave equipment

Similar Documents

Publication Publication Date Title
JPS5315763A (en) Resin sealed type semiconductor device
JPS5315784A (en) Semiconductor device
JPS534472A (en) Semiconductor package
JPS5247382A (en) Varactor diode device
JPS5251879A (en) Semiconductor integrated circuit
JPS532078A (en) Sealing structure for semiconductor device
JPS5577160A (en) Semiconductor device
JPS5273686A (en) Production of photoelectric converting element
JPS5272586A (en) Production of semiconductor device
JPS52102675A (en) Insulating tape and preparation of semiconductor device using the same same
JPS5335378A (en) Bump type semiconductor device
JPS5314560A (en) Production of semiconductor device
JPS53118374A (en) Integrated diode device
JPS5280780A (en) Semiconductor device
JPS538570A (en) Semiconductor device
JPS5385160A (en) Production of semiconductor device
JPS534471A (en) Semiconductor package
JPS5332674A (en) Sealing structure of semiconductor device and its production
JPS5338981A (en) Semiconductor device
JPS5348471A (en) Production of resin seal type semiconductor device
JPS5339869A (en) Semiconductor chip mounting base plate
JPS5374368A (en) Package for semiconductor device
JPS54577A (en) Resin seal semiconductor device
JPS5291647A (en) Production of semiconductor device
JPS5571051A (en) Semiconductor device