JPS53133799A - Electroconductive paint - Google Patents

Electroconductive paint

Info

Publication number: JPS53133799A
Authority: JP; Japan
Prior art keywords: electroconductive paint; electroconductive; paint
Prior art date: 1977-04-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP4881077A

Other languages

Japanese (ja)

Inventor

Yuuzou Kawamura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

IDEARISAACHI YUUGEN

Original Assignee

IDEARISAACHI YUUGEN

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1977-04-27

Filing date

1977-04-27

Publication date

1978-11-21

1977-04-27 Application filed by IDEARISAACHI YUUGEN filed Critical IDEARISAACHI YUUGEN

1977-04-27 Priority to JP4881077A priority Critical patent/JPS53133799A/en

1978-11-21 Publication of JPS53133799A publication Critical patent/JPS53133799A/en

Status Pending legal-status Critical Current

Landscapes

Paints Or Removers (AREA)
Conductive Materials (AREA)

JP4881077A 1977-04-27 1977-04-27 Electroconductive paint Pending JPS53133799A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP4881077A JPS53133799A (en)	1977-04-27	1977-04-27	Electroconductive paint

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP4881077A JPS53133799A (en)	1977-04-27	1977-04-27	Electroconductive paint

Publications (1)

Publication Number	Publication Date
JPS53133799A true JPS53133799A (en)	1978-11-21

Family

ID=12813555

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4881077A Pending JPS53133799A (en)	1977-04-27	1977-04-27	Electroconductive paint

Country Status (1)

Country	Link
JP (1)	JPS53133799A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57208002A (en) *	1981-06-18	1982-12-21	Shinetsu Polymer Co	Thermal pressure conductive composition
JPS58121504A (en) *	1982-01-12	1983-07-19	東芝ケミカル株式会社	Conductive paste
EP0613330A1 (en) *	1992-11-09	1994-08-31	Siemens Aktiengesellschaft	Discrete wiring method for printed circuit boards and/or electronic component assemblies
US5376403A (en) *	1990-02-09	1994-12-27	Capote; Miguel A.	Electrically conductive compositions and methods for the preparation and use thereof
WO1998008362A1 (en) *	1996-08-16	1998-02-26	Craig Hugh P	Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
EP0793405A3 (en) *	1996-02-28	1998-12-02	CTS Corporation	Multilayer electronic assembly utilizing a sinterable composition and related method of forming
EP0886461A1 (en) *	1997-05-28	1998-12-23	Yazaki Corporation	Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
US5853622A (en) *	1990-02-09	1998-12-29	Ormet Corporation	Transient liquid phase sintering conductive adhesives
US7022266B1 (en)	1996-08-16	2006-04-04	Dow Corning Corporation	Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
EP1054429B1 (en) *	1999-05-21	2009-12-23	Thomson Plasma	Process for forming electrodes
US8221518B2 (en)	2009-04-02	2012-07-17	Ormet Circuits, Inc.	Conductive compositions containing blended alloy fillers
US8840700B2 (en)	2009-11-05	2014-09-23	Ormet Circuits, Inc.	Preparation of metallurgic network compositions and methods of use thereof
US9005330B2 (en)	2012-08-09	2015-04-14	Ormet Circuits, Inc.	Electrically conductive compositions comprising non-eutectic solder alloys
US9583453B2 (en)	2012-05-30	2017-02-28	Ormet Circuits, Inc.	Semiconductor packaging containing sintering die-attach material
US12053934B2 (en)	2012-06-18	2024-08-06	Ormet Circuits, Inc.	Conductive film adhesive

1977
- 1977-04-27 JP JP4881077A patent/JPS53133799A/en active Pending

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57208002A (en) *	1981-06-18	1982-12-21	Shinetsu Polymer Co	Thermal pressure conductive composition
JPS58121504A (en) *	1982-01-12	1983-07-19	東芝ケミカル株式会社	Conductive paste
US5853622A (en) *	1990-02-09	1998-12-29	Ormet Corporation	Transient liquid phase sintering conductive adhesives
US5376403A (en) *	1990-02-09	1994-12-27	Capote; Miguel A.	Electrically conductive compositions and methods for the preparation and use thereof
US5830389A (en) *	1990-02-09	1998-11-03	Toranaga Technologies, Inc.	Electrically conductive compositions and methods for the preparation and use thereof
EP0613330A1 (en) *	1992-11-09	1994-08-31	Siemens Aktiengesellschaft	Discrete wiring method for printed circuit boards and/or electronic component assemblies
EP0793405A3 (en) *	1996-02-28	1998-12-02	CTS Corporation	Multilayer electronic assembly utilizing a sinterable composition and related method of forming
WO1998008362A1 (en) *	1996-08-16	1998-02-26	Craig Hugh P	Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
US7022266B1 (en)	1996-08-16	2006-04-04	Dow Corning Corporation	Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
EP0886461A1 (en) *	1997-05-28	1998-12-23	Yazaki Corporation	Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
US6054175A (en) *	1997-05-28	2000-04-25	Yazaki Corporation	Conductive filler, conductive paste and method of fabricating circuit body using the conductive paste
EP1054429B1 (en) *	1999-05-21	2009-12-23	Thomson Plasma	Process for forming electrodes
US8221518B2 (en)	2009-04-02	2012-07-17	Ormet Circuits, Inc.	Conductive compositions containing blended alloy fillers
US8840700B2 (en)	2009-11-05	2014-09-23	Ormet Circuits, Inc.	Preparation of metallurgic network compositions and methods of use thereof
US9583453B2 (en)	2012-05-30	2017-02-28	Ormet Circuits, Inc.	Semiconductor packaging containing sintering die-attach material
US12053934B2 (en)	2012-06-18	2024-08-06	Ormet Circuits, Inc.	Conductive film adhesive
US9005330B2 (en)	2012-08-09	2015-04-14	Ormet Circuits, Inc.	Electrically conductive compositions comprising non-eutectic solder alloys

Publication	Publication Date	Title
JPS5452632A (en)	1979-04-25	Wearrresistant coating
JPS5454145A (en)	1979-04-28	Pigment paste
JPS5491790A (en)	1979-07-20	Flat cable
JPS53105896A (en)	1978-09-14	Gun
JPS5481925A (en)	1979-06-29	Crayon
JPS53112843A (en)	1978-10-02	New 44acylaminoophenyllethanollamine
GB2003890B (en)	1982-04-28	Pigments
JPS5456436A (en)	1979-05-07	Electrostatic recrder
JPS53133799A (en)	1978-11-21	Electroconductive paint
JPS53110097A (en)	1978-09-26	Electroconductive composition
JPS53110218A (en)	1978-09-26	Assembly apparatus
JPS5396579A (en)	1978-08-23	Revetting gun
GB2001011B (en)	1982-03-17	Pencil
HK32783A (en)	1983-09-02	New phenylazacycloalkanes
JPS53102930A (en)	1978-09-07	Conducting paint
AU3890178A (en)	1980-02-21	Coating
JPS53118795A (en)	1978-10-17	Electroconductive paint
PT68623A (en)	1978-11-01	Antifouling paint
JPS5446231A (en)	1979-04-12	Hard coating
JPS5322533A (en)	1978-03-02	Paint
GB2006176B (en)	1982-05-26	Coatings
GB2011444B (en)	1982-05-26	Paint
JPS53124539A (en)	1978-10-31	Fireeproof paint
JPS5478341A (en)	1979-06-22	Coated arccweldinggrod
JPS5472121A (en)	1979-06-09	Eraser