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JPS53133243A - Epoxy resin adhesive - Google Patents

Epoxy resin adhesive

Info

Publication number
JPS53133243A
JPS53133243A JP4742477A JP4742477A JPS53133243A JP S53133243 A JPS53133243 A JP S53133243A JP 4742477 A JP4742477 A JP 4742477A JP 4742477 A JP4742477 A JP 4742477A JP S53133243 A JPS53133243 A JP S53133243A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin adhesive
indophenol
naphthoquinone
benzoquinone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4742477A
Other languages
Japanese (ja)
Inventor
Kazuo Kurauchi
Yoshinori Sakakibara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pentel Co Ltd
Original Assignee
Pentel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentel Co Ltd filed Critical Pentel Co Ltd
Priority to JP4742477A priority Critical patent/JPS53133243A/en
Publication of JPS53133243A publication Critical patent/JPS53133243A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To make it possible to determine the mixing conditions of epoxy resins with a curing agent with the naked eye easily, by adding a benzoquinone, naphthoquinone, or indophenol to an epoxy resin.
COPYRIGHT: (C)1978,JPO&Japio
JP4742477A 1977-04-26 1977-04-26 Epoxy resin adhesive Pending JPS53133243A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4742477A JPS53133243A (en) 1977-04-26 1977-04-26 Epoxy resin adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4742477A JPS53133243A (en) 1977-04-26 1977-04-26 Epoxy resin adhesive

Publications (1)

Publication Number Publication Date
JPS53133243A true JPS53133243A (en) 1978-11-20

Family

ID=12774763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4742477A Pending JPS53133243A (en) 1977-04-26 1977-04-26 Epoxy resin adhesive

Country Status (1)

Country Link
JP (1) JPS53133243A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015214601A (en) * 2014-05-07 2015-12-03 積水フーラー株式会社 Radiation curable hot-melt adhesive
WO2018173991A1 (en) * 2017-03-23 2018-09-27 ナミックス株式会社 Resin composition, adhesive for electronic part, semiconductor device, and electronic part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015214601A (en) * 2014-05-07 2015-12-03 積水フーラー株式会社 Radiation curable hot-melt adhesive
WO2018173991A1 (en) * 2017-03-23 2018-09-27 ナミックス株式会社 Resin composition, adhesive for electronic part, semiconductor device, and electronic part
JPWO2018173991A1 (en) * 2017-03-23 2020-01-23 ナミックス株式会社 Resin composition, adhesive for electronic parts, semiconductor device, and electronic parts
TWI816661B (en) * 2017-03-23 2023-10-01 日商納美仕有限公司 Resin composition, adhesive for electronic component, semiconductor device, and electronic component

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