JPS53133243A - Epoxy resin adhesive - Google Patents
Epoxy resin adhesiveInfo
- Publication number
- JPS53133243A JPS53133243A JP4742477A JP4742477A JPS53133243A JP S53133243 A JPS53133243 A JP S53133243A JP 4742477 A JP4742477 A JP 4742477A JP 4742477 A JP4742477 A JP 4742477A JP S53133243 A JPS53133243 A JP S53133243A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin adhesive
- indophenol
- naphthoquinone
- benzoquinone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To make it possible to determine the mixing conditions of epoxy resins with a curing agent with the naked eye easily, by adding a benzoquinone, naphthoquinone, or indophenol to an epoxy resin.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4742477A JPS53133243A (en) | 1977-04-26 | 1977-04-26 | Epoxy resin adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4742477A JPS53133243A (en) | 1977-04-26 | 1977-04-26 | Epoxy resin adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53133243A true JPS53133243A (en) | 1978-11-20 |
Family
ID=12774763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4742477A Pending JPS53133243A (en) | 1977-04-26 | 1977-04-26 | Epoxy resin adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53133243A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015214601A (en) * | 2014-05-07 | 2015-12-03 | 積水フーラー株式会社 | Radiation curable hot-melt adhesive |
WO2018173991A1 (en) * | 2017-03-23 | 2018-09-27 | ナミックス株式会社 | Resin composition, adhesive for electronic part, semiconductor device, and electronic part |
-
1977
- 1977-04-26 JP JP4742477A patent/JPS53133243A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015214601A (en) * | 2014-05-07 | 2015-12-03 | 積水フーラー株式会社 | Radiation curable hot-melt adhesive |
WO2018173991A1 (en) * | 2017-03-23 | 2018-09-27 | ナミックス株式会社 | Resin composition, adhesive for electronic part, semiconductor device, and electronic part |
JPWO2018173991A1 (en) * | 2017-03-23 | 2020-01-23 | ナミックス株式会社 | Resin composition, adhesive for electronic parts, semiconductor device, and electronic parts |
TWI816661B (en) * | 2017-03-23 | 2023-10-01 | 日商納美仕有限公司 | Resin composition, adhesive for electronic component, semiconductor device, and electronic component |
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