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JPS53112461A - Hyb ic - Google Patents

Hyb ic

Info

Publication number
JPS53112461A
JPS53112461A JP2746677A JP2746677A JPS53112461A JP S53112461 A JPS53112461 A JP S53112461A JP 2746677 A JP2746677 A JP 2746677A JP 2746677 A JP2746677 A JP 2746677A JP S53112461 A JPS53112461 A JP S53112461A
Authority
JP
Japan
Prior art keywords
hyb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2746677A
Other languages
Japanese (ja)
Inventor
Osamu Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2746677A priority Critical patent/JPS53112461A/en
Publication of JPS53112461A publication Critical patent/JPS53112461A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP2746677A 1977-03-12 1977-03-12 Hyb ic Pending JPS53112461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2746677A JPS53112461A (en) 1977-03-12 1977-03-12 Hyb ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2746677A JPS53112461A (en) 1977-03-12 1977-03-12 Hyb ic

Publications (1)

Publication Number Publication Date
JPS53112461A true JPS53112461A (en) 1978-09-30

Family

ID=12221884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2746677A Pending JPS53112461A (en) 1977-03-12 1977-03-12 Hyb ic

Country Status (1)

Country Link
JP (1) JPS53112461A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01150332A (en) * 1987-12-07 1989-06-13 Nec Corp Printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01150332A (en) * 1987-12-07 1989-06-13 Nec Corp Printed circuit board

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